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Flat heat pipe and method for manufacturing the same

a heat pipe and flat technology, applied in the field of flat heat pipes, can solve the problems of inability to retrieve condensate from the condenser section in time, damage to the wick structure of the heat pipe, and a large increase in the flow resistance of the wick structur

Inactive Publication Date: 2011-07-21
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a flat heat pipe with high heat transfer efficiency and a method for manufacturing it. The heat pipe has a flat tube-like casing with two sealed ends and various elements enclosed inside. The casing is made of metal or metal alloy with high heat conductivity. The heat pipe has a flattened transverse cross section and is designed to improve heat transfer between an electronic component and the evaporator section of the heat pipe. The technical effects of the patent text include improved heat transfer, reduced damage to the wick structure, and improved manufacturing method for the flat heat pipe.

Problems solved by technology

However, this may result in damage to the wick structure of the heat pipe.
When the wick structure of the heat pipe is damaged, the flow resistance of the wick structure is liable to be considerably increased.
In such case, the condensate may not be retrieved from the condenser section in a timely manner, and the heat pipe eventually dries out at the evaporator section.

Method used

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  • Flat heat pipe and method for manufacturing the same
  • Flat heat pipe and method for manufacturing the same
  • Flat heat pipe and method for manufacturing the same

Examples

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Embodiment Construction

[0018]Referring to FIGS. 1-3, a heat pipe 10 in accordance with a first embodiment of the disclosure is shown. The heat pipe 10 is a flat heat pipe, and includes a flat tube-like casing 11 with two ends thereof sealed, and a variety of elements enclosed in the casing 11. Such elements include two first wick structures 12, 13, a second wick structure 14, and a working medium (not shown).

[0019]The casing 11 is made of metal or metal alloy with a high heat conductivity coefficient, such as copper, copper-alloy, or other suitable material. The casing 11 is elongated, and has an evaporator section 111 and an opposite condenser section 113 along a longitudinal direction thereof. The casing 11 has a width larger than its height. In particular, the casing 11 has a flattened transverse cross section. To meet the weight requirements of common electronic products, the height of the casing 11 is preferably less than 2 millimeters (mm) The casing 11 is hollow, and includes a top plate 114, a bot...

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Abstract

An exemplary flat heat pipe with an evaporator section and a condenser section at opposite ends thereof includes a hollow flat casing, a first wick structure and a solid and sintered second wick structure. The first wick structure includes a top plate and a bottom plate opposite to the top plate. The first wick structure is received in the casing, and extends from the evaporator section to the condenser section. The second wick structure is disposed in the casing at the evaporator section. The second wick structure contacts the top and bottom plates and joins the first wick structure. A method for manufacturing the heat pipe is also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is related to two co-pending applications respectively entitled “FLAT HEAT PIPE WITH VAPOR CHANNEL” (attorney docket number US32037) and “FLAT HEAT PIPE” (attorney docket number US32038), assigned to the same assignee of this application and filed on the same date as this application. The two related applications are incorporated herein by reference.BACKGROUND[0002]1. Technical Field[0003]The disclosure generally relates to a heat transfer apparatus, and particularly to a flat heat pipe with high heat transfer efficiency.[0004]2. Description of Related Art[0005]Heat pipes are widely used in various fields for heat dissipation purposes due to their excellent heat transfer performance. One commonly used heat pipe includes a sealed tube made of thermally conductive material with a working fluid contained therein. The working fluid conveys heat from one end of the tube, typically referred to as an evaporator section, to the o...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/04B21D53/02
CPCB23P2700/09Y10T29/49353F28D15/0233F28D15/046
Inventor LIU, YUEDAI, SHENG-LIANGLIU, JIN-PENGZHOU, SHENG-GUOWU, SHENG-LINLO, YU-LIANG
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD