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Modular heat sink and method for fabricating same

a heat sink and module technology, applied in the direction of tubular elements, lighting and heating apparatus, laminated elements, etc., can solve the problems of shortening the life of a lighting system and/or reducing its brightness, emitted heat can be harmful to the device, and the dimensions of heat sinks are limited

Inactive Publication Date: 2011-09-22
PHOSTER INDS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Devices such as electronic circuits and lighting systems usually emit heat while functioning, and this emitted heat can be harmful to the device.
For example, an increased temperature can shorten the lifetime of a lighting system and / or decrease its brightness.
However, when using this fabrication process, the dimensions of heat sinks are limited because of limitations inherent to the extrusion process.
Hence, it is not possible to make heat sinks for large lighting systems when using the extrusion process.

Method used

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  • Modular heat sink and method for fabricating same
  • Modular heat sink and method for fabricating same
  • Modular heat sink and method for fabricating same

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Embodiment Construction

[0022]FIG. 1 illustrates a heat sink 10 according to the prior art. Heat sink 10 comprises a top and a bottom circular surface and a lateral cylindrical surface. The heat sink 10 has a specific shape in order to increase its total surface area that is in contact with a cooling fluid such as air. The lateral surface of the heat sink 10 is provided with fins 12. A central aperture 14 and lateral apertures 16 extend from the top surface to the bottom surface. The fins 12, the central aperture 14 and the lateral apertures 16 increase the total surface area of heat sink 10 that is in contact with air, which allows the cooling of an electronic device to be in physical contact with the heat sink 10.

[0023]According to the prior art, heat sinks are made in a single piece. When heat conductive material such as aluminum or copper is used to fabricate heat sinks by extrusion, the size of the heat sink is limited because of the extrusion process. Extrusion can be any adequate fabrication process...

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Abstract

There is described a method for fabricating a modular heat sink, the method comprising: extruding N individual integral heat sink segments using an extrusion process, each one of the N segments corresponding to 1 / N of the modular heat sink, N being an integer greater than one; and assembling the N individual integral heat sink segments together in order to obtain the modular heat sink.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation under 35 USC §120 of International patent application no. PCT / CA2009 / 000551 filed Apr. 24, 2009 entitled MODULAR HEAT SINK AND METHOD FOR FABRICATING SAME, which claims priority under 35 USC §119(e) of Provisional Patent Application bearing Ser. No. 61 / 048,400, filed on Apr. 28, 2008, the contents of which are hereby incorporated by reference.TECHNICAL FIELD[0002]The present invention relates to the field of heat dissipation devices, also known as heat sinks.BACKGROUND OF THE INVENTION[0003]Devices such as electronic circuits and lighting systems usually emit heat while functioning, and this emitted heat can be harmful to the device. For example, an increased temperature can shorten the lifetime of a lighting system and / or decrease its brightness. As a result, cooling the lighting device is required to ensure a long lifetime and / or a high brightness.[0004]Heat sinks can be used to cool heat genera...

Claims

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Application Information

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IPC IPC(8): F28F7/00B21D53/02
CPCB21C23/10Y10T29/4935B23P2700/10F28D2021/0029F28F1/16F28F1/42F28F1/422F28F3/02F28F21/084F28F21/085F28F2275/14H01L21/4882H01L23/367H01L2924/0002B21C23/14H01L2924/00
Inventor PLONSKI, ERANKUMAR, SHARATHBAQUI, EIHAB
Owner PHOSTER INDS