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MXM interface test system and connection apparatus thereof

a technology of interface test system and motherboard, which is applied in the field of test system to test the interface of the mobile peripheral component interconnect express module (mxm) of the motherboard, and can solve problems such as easy damage to the motherboard

Inactive Publication Date: 2012-03-22
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a test system for testing the performance of signals transmitted through a mobile peripheral component interconnect express (MXM) interface on a motherboard. The test system includes a connection apparatus that is inserted into the MXM interface and connected to a test apparatus, such as an oscilloscope, using a connector. The connection apparatus includes a circuit board, a golden finger connector, a filter unit, and signal test contacts. The test system does not require any soldering of wires to the MXM interface, which can protect the motherboard from damage. The test system can effectively determine the characteristics of signal transmissions through the MXM interface without causing any damage.

Problems solved by technology

However, the motherboard may be easily damaged because of disoperation during soldering.

Method used

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  • MXM interface test system and connection apparatus thereof
  • MXM interface test system and connection apparatus thereof
  • MXM interface test system and connection apparatus thereof

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Experimental program
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Embodiment Construction

[0009]FIG. 1 shows a MXM interface test system 100 used to test characteristics of signal transmission of a MXM interface 200, according to an exemplary embodiment. In this embodiment, the MXM interface 200 includes a group of signal transmitting contacts RX0-RX17 for data and clock signal transmission.

[0010]The MXM interface test system 100 includes a connection apparatus 11, at least one connector 12, and a test apparatus 13 connected in series.

[0011]Referring to FIG. 2, the connection apparatus 11 includes a circuit board 111, a golden finger connector 112, a filter unit 113, and a group of signal test contacts D0-D17. The circuit board 111 can be inserted into the MXM interface 200. The golden finger connector 112 includes a group of signal connection contacts TX0-TX17 corresponding to the signal transmitting contacts RX0-RX15 of the MXM interface 200. When the circuit board is inserted into the MXM interface 200, the golden finger connector 112 connects to the MXM interface 200...

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Abstract

A connection apparatus for connecting a mobile peripheral component interconnect express module (MXM) interface to a test apparatus includes a circuit board, a golden finger connector, and a group of signal test contacts. The test contacts are connected to the golden finger connector and configured for connection to the testing apparatus. When the circuit board is inserted into a MXM interface, the test contacts connect to the MXM interface.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure generally relates to test systems, particularly to a test system for testing mobile peripheral component interconnect express module (MXM) interface of a motherboard.[0003]2. Description of Related Art[0004]MXM is an interconnect standard for graphics processing units (GPU) or graphic cards in laptops using PCI Express. MXM interfaces are widely used on a motherboard for receiving the graphics card. To ensure performance of the graphics card, it is necessary to test characteristic of signals transmission of the MXM interface. A typical method to test the MXM interface is to solder a wire to pins of the MXM interface and output signals transmitted from the MXM interface to an oscilloscope by the wire. However, the motherboard may be easily damaged because of disoperation during soldering.[0005]Therefore, there is room for improvement within the art.BRIEF DESCRIPTION OF THE DRAWINGS[0006]Many aspects of the MXM interface test syst...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G01R31/04H01R12/00
CPCG06F11/2284G06F11/221
Inventor MA, YOU-LIANGYANG, BOLI, FA-CUNWANG, TAI-CHEN
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD