Substrate treatment apparatus and substrate treatment method

Active Publication Date: 2012-10-04
DAINIPPON SCREEN MTG CO LTD
View PDF18 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]It is an object of the present invention to provide a substrate treatment

Problems solved by technology

Therefore, the rinse liquid hardly reaches the spouting region, failing to form a sufficiently thick rinse liquid film on the spouting region.
The impingemen

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method

Examples

Experimental program
Comparison scheme
Effect test

Example

[0084]In the first embodiment, as described above, the treatment liquid droplets are spouted from the liquid droplet nozzle 5 toward the upper surface of the substrate W horizontally held by the spin chuck 2. Thus, the treatment liquid droplets are sprayed on the spouting regions T1 on the upper surface of the substrate W. Simultaneously with the spouting of the treatment liquid from the liquid droplet nozzle 5, the protective liquid is spouted from the protective liquid nozzle 6 toward the upper surface of the substrate W. The protective liquid spouted from the protective liquid nozzle 6 impinges on the substrate W to be deflected, and spreads on the substrate W to flow toward the spouting regions T1 on the upper surface of the substrate W. The protective liquid spreading on the substrate W flows into the spouting regions T1 against the treatment liquid droplets sprayed on the spouting regions T1. That is, flow speed control conditions including at least one of the spouting speed o...

Example

[0091]Next, a second embodiment of the present invention will be described. In FIG. 15, components corresponding to those shown in FIGS. 1 to 14 will be designated by the same reference characters as in FIGS. 1 to 14, and duplicate description will be omitted.

[0092]FIG. 15 is a schematic side view of a liquid droplet nozzle 205 and a protective liquid nozzle 6 according to the second embodiment of the present invention.

[0093]A substrate treatment apparatus 201 according to the second embodiment has substantially the same construction as the substrate treatment apparatus 1 according to the first embodiment, except for the liquid droplet nozzle. That is, the substrate treatment apparatus 201 includes liquid droplet nozzles 205, instead of the liquid droplet nozzle 5 according to the first embodiment, which generates treatment liquid droplets to be sprayed on spouting regions T201. In the second embodiment, the substrate treatment apparatus 201 includes two liquid droplet nozzles 205. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a liquid droplet nozzle which generates droplets of a treatment liquid which are sprayed on a spouting region on an upper surface of the substrate held by the substrate holding unit; and a protective liquid nozzle which spouts a protective liquid obliquely onto the upper surface of the substrate held by the substrate holding unit for protection of the substrate to cause the protective liquid to flow toward the spouting region on the upper surface of the substrate, whereby the spouting region is covered with a film of the protective liquid and, in this state, the treatment liquid droplets are caused to impinge on the spouting region.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a substrate treatment apparatus and a substrate treatment method for treating a substrate. Examples of the substrate to be treated include semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma display devices, substrates for FED (Field Emission Display) devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photo masks, ceramic substrates, and substrates for solar cells.[0003]2. Description of the Related Art[0004]In production processes for semiconductor devices and liquid crystal display devices, substrates such as semiconductor wafers and glass substrates for liquid crystal display panels are treated with a treatment liquid. A substrate treatment apparatus of a single substrate treatment type adapted to treat a single substrate at a time includes, for example, a spin chuck which ho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B3/04B08B7/00
CPCH01L21/02052H01L21/67057H01L21/67051H01L21/67028H01L21/02H01L21/302
Inventor TANAKA, TAKAYOSHIYAMAKAWA, MAIYAMAGUCHI, TAKAHIRO
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products