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Substrate treatment apparatus and substrate treatment method

Active Publication Date: 2012-10-04
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]It is an object of the present invention to provide a substrate treatment apparatus and a substrate treatment method which suppress damages to a substrate.

Problems solved by technology

Therefore, the rinse liquid hardly reaches the spouting region, failing to form a sufficiently thick rinse liquid film on the spouting region.
The impingement of the liquid droplets on the substrate results insignificant impact on a pattern formed on the substrate, causing damages such as collapse of the pattern.

Method used

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  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method

Examples

Experimental program
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Effect test

first embodiment

[0041]The spin chuck 2 includes a spin base 8 which horizontally holds the substrate W and is rotatable about a vertical rotation axis L1 extending through a center C1 of the substrate W, and a spin motor 9 which rotates the spin base 8 about the rotation axis L1. The spin chuck 2 may be a clamp chuck adapted to horizontally clamp the substrate W to horizontally hold the substrate W or a vacuum chuck adapted to suck a back surface (lower surface) of the substrate W serving as a non-device-formation surface to horizontally hold the substrate W. In the first embodiment, the spin chuck 2 is the clamp chuck.

[0042]The rinse liquid nozzle 4 is connected to a rinse liquid supply pipe 11 provided with a rinse liquid valve 10. With the rinse liquid valve 10 open, the rinse liquid is spouted from the rinse liquid nozzle 4 toward a center portion of the upper surface of the substrate W. With the rinse liquid valve 10 closed, on the other hand, the spouting of the rinse liquid from the rinse li...

second embodiment

[0091]Next, the present invention will be described. In FIG. 15, components corresponding to those shown in FIGS. 1 to 14 will be designated by the same reference characters as in FIGS. 1 to 14, and duplicate description will be omitted.

[0092]FIG. 15 is a schematic side view of a liquid droplet nozzle 205 and a protective liquid nozzle 6 according to the second embodiment of the present invention.

[0093]A substrate treatment apparatus 201 according to the second embodiment has substantially the same construction as the substrate treatment apparatus 1 according to the first embodiment, except for the liquid droplet nozzle. That is, the substrate treatment apparatus 201 includes liquid droplet nozzles 205, instead of the liquid droplet nozzle 5 according to the first embodiment, which generates treatment liquid droplets to be sprayed on spouting regions T201. In the second embodiment, the substrate treatment apparatus 201 includes two liquid droplet nozzles 205. The two liquid droplet ...

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Abstract

A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a liquid droplet nozzle which generates droplets of a treatment liquid which are sprayed on a spouting region on an upper surface of the substrate held by the substrate holding unit; and a protective liquid nozzle which spouts a protective liquid obliquely onto the upper surface of the substrate held by the substrate holding unit for protection of the substrate to cause the protective liquid to flow toward the spouting region on the upper surface of the substrate, whereby the spouting region is covered with a film of the protective liquid and, in this state, the treatment liquid droplets are caused to impinge on the spouting region.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a substrate treatment apparatus and a substrate treatment method for treating a substrate. Examples of the substrate to be treated include semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma display devices, substrates for FED (Field Emission Display) devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photo masks, ceramic substrates, and substrates for solar cells.[0003]2. Description of the Related Art[0004]In production processes for semiconductor devices and liquid crystal display devices, substrates such as semiconductor wafers and glass substrates for liquid crystal display panels are treated with a treatment liquid. A substrate treatment apparatus of a single substrate treatment type adapted to treat a single substrate at a time includes, for example, a spin chuck which ho...

Claims

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Application Information

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IPC IPC(8): B08B3/04B08B7/00
CPCH01L21/02052H01L21/67057H01L21/67051H01L21/67028H01L21/02H01L21/302
Inventor TANAKA, TAKAYOSHIYAMAKAWA, MAIYAMAGUCHI, TAKAHIRO
Owner DAINIPPON SCREEN MTG CO LTD
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