Dc/dc convertor power module package incorporating a stacked controller and construction methodology

a technology of power module and stacked controller, which is applied in the direction of resistors, basic electric elements, solid-state devices, etc., can solve the problems of increasing fabrication costs, increasing the failure rate of the packages produced, and increasing the problem of large surface area
US20120326287A1Inactive Publication Date: 2012-12-27NAT SEMICON CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
NAT SEMICON CORP
Publication Date
2012-12-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

Methods and systems are described for enabling the efficient fabrication of small form factor power converters and also the small form factor power converter devices.
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Description

TECHNICAL FIELD

[0001] The present invention relates generally to power converter devices used in association with semiconductor systems. In particular, the invention refers to power converters used in DC-DC power level shifting devices and associated packages having reduced sizes and footprints. Also, the invention relates to methods of construction and packaging of these reduced size converter packages.BACKGROUND OF THE INVENTION

[0002] In the field of electronic and computer devices, there is a need for converting one power level to another power level to enable the operation of various systems. The power level required for the various electronic systems is quite commonly different from a power level provided to the electronic device. Also, several different power levels may be required to power the various systems of an electronic device.

[0003] Also, the same electronic device typically includes systems requiring several different power levels. Thus, in many electronic devices, there...

Claims

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