Semiconductor package including a step type substrate

Abstract

Disclosed herein are semiconductor packages. A semiconductor package may include a substrate configured to include a first face and a second face opposite the first face and to have a recess formed in the first face. The semiconductor package may include a first semiconductor chip disposed on the bottom of the recess. The semiconductor package may include a second semiconductor chip disposed on the second face of the substrate. The semiconductor package may include a third semiconductor chip disposed over the first face of the substrate and the first semiconductor chip. The semiconductor package may include a fourth semiconductor chip disposed over the third semiconductor chip.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority under 35 U.S.C. §119(a) to Korean Patent Application No. 10-2015-0090940 filed on Jun. 26, 2015, in the Korean Intellectual Property Office, which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]Various embodiments generally relate to a semiconductor package, and more particularly, to a semiconductor package including a step type substrate.[0004]2. Related Art[0005]As electronic products are reduced in size and have higher functionality, semiconductor chips having higher capacities have been required to satisfy certain functions. Furthermore, there has been a need to mount a larger number of semiconductor chips on an electronic product having a smaller size.[0006]However, technologies in which a semiconductor chip having a high capacity is manufactured or a larger number of semiconductor chips are disposed in a limited space have reached their limits. Thus,...

AI Technical Summary

Benefits of technology

This design enhances structural stability and reduces package thickness, preventing bending and ensuring efficient electrical coupling while maintaining a compact form factor, allowing for the integration of multiple high-capacity chips without increasing overall thickness.

Problems solved by technology

However, technologies in which a semiconductor chip having a high capacity is manufactured or a larger number of semiconductor chips are disposed in a limited space have reached their limits.

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