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Polishing composition and polishing method

a technology of polishing composition and polishing method, which is applied in the direction of lapping machines, manufacturing tools, other chemical processes, etc., can solve the problems of poor redispersibility of abrasives after long-term storage, poor polishing performance, and blockage of pipes, so as to prevent the settling of abrasives, improve the redispersibility of abrasives, and maintain polishing performance

Inactive Publication Date: 2020-12-17
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]In addition, another object of the present invention is to provide a solution for improving the redispersibility of an abrasive while maintaining the polishing performance.

Problems solved by technology

However, the polishing composition described in JP 2012-248569 A has been problematic in that because the dispersibility of abrasive is poor, the polishing performance is not stable, and also, during the production or use of the polishing composition, the abrasive settles in a pipe or a slurry supply tube, causing the blockage of the pipe or the like.
There also is a problem in that the redispersibility of an abrasive after long-term storage is also poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

examples

[0055]The present invention will be described in further detail using the following examples and comparative examples. However, the technical scope of the present invention is not limited only to the following examples.

examples 7 to 12

, Comparative Example 4: Examination of Storage Conditions

[0085]With respect to the polishing composition prepared in Example 2 above, using the polishing composition after storage at the storage temperature for the number of days of storage shown in Table 2 below, the above (Evaluation of Anti-settling Properties of Abrasive), (Evaluation of Redispersibility of Abrasive), and (Evaluation of Polishing) were performed.

[0086]In addition, with respect to the polishing composition after storage, the measurement of viscosity and the evaluation of abrasive aggregation / hardening suppression ability were performed as follows.

(Measurement of Viscosity)

[0087]The polishing composition prepared in each example was charged in a Brookfield viscometer TVB-10 manufactured by Toki Sangyo Co., Ltd., and the viscosity was measured at a measurement temperature of 25° C. and a rotational speed of 100 rpm. The kind of rotor used in the measurement is H3.

(Evaluation of Abrasive Aggregation / Hardening Suppr...

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Abstract

The present invention provides a solution for preventing the settling of an abrasive while maintaining the polishing performance. In addition, the present invention provides a solution for improving the redispersibility of an abrasive while maintaining the polishing performance.The present invention relates to a polishing composition for use in polishing a semiconductor substrate, the polishing composition containing an abrasive, a layered compound, and a dispersion medium.

Description

TECHNICAL FIELD[0001]The present invention relates to a polishing composition.BACKGROUND ART[0002]Generally, in the polishing of a semiconductor substrate, such as a silicon wafer or silicon carbide, not to mention the improvement of surface quality accompanying increases in the performance and integration density of semiconductor devices, the improvement of production efficiency in order to deal with the increasing demands of recent years has been regarded as an important issue. As a technology for solving this problem, for example, JP 2012-248569 A discloses a polishing agent characterized by containing an oxidizing agent containing a transition metal having an oxidation reduction potential of 0.5 V or more, cerium oxide particles having an average secondary particle size of 0.5 μm or less, and a dispersion medium.SUMMARY OF INVENTION[0003]However, the polishing composition described in JP 2012-248569 A has been problematic in that because the dispersibility of abrasive is poor, t...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09G1/02B24B37/04C09K3/14H01L21/306
CPCC09K3/1409H01L21/30625B24B37/044C09G1/02C09K3/1463H01L21/02024
Inventor ISHIBASHI, TOMOAKIKON, HIROKI
Owner FUJIMI INCORPORATED