Substrate carrier and diffusion module thereof
a technology of substrate carrier and diffusion module, which is applied in the direction of electrical equipment, special packaging, packaging goods type, etc., can solve the problems of affecting the yield of semiconductor products, unable to actively exclude small particles, and gas cannot be completely cleaned
Inactive Publication Date: 2021-01-14
GUDENG PRECISION IND CO LTD
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- Description
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Benefits of technology
The present invention is about a semiconductor substrate carrier and its diffusion module. The invention is about improving the clean effect of the substrate carrier by creating a uniform flow of gas in the air chamber of the substrate carrier. This results in a cleaner environment for the substrate during processing.
Problems solved by technology
Carriers used for transporting components required for semiconductor manufacturing are required to have strict air tightness in order to prevent small particles from attaching to these components during loading or storage, thereby affecting the yield of semiconductor products.
However, purely air-tight means that it can only passively prevent small particles from entering, but unable to actively exclude small particles which have been previously attached to base materials such as substrate or reticle.
Although it is feasible to control the gas flowing through the valve on the semiconductor container, there is still a risk that the gas cannot be completely cleaned b just by uniformly blown on the semiconductor material such as the substrate or reticle.
The design of the inner part of the semiconductor container also makes the replacement more inconvenient.
Method used
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[0015]In order to understand the technical features and practical efficacy of the present invention and to implement it in accordance with the contents of the specification, hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0016]Referring to FIG. 1 and FIG. 2, FIG. 1 illustrates a schematic diagram of the structure of the embodiment of the present invention, and FIG. 2 shows a schematic diagram of the inner structure of the outer cover of the embodiment of the present invention. As shown in FIG. 1, a container 200 engaged with an air diffusion module 10 is provided. In this embodiment, the container 200 is a substrate carrier, and further, a front opening unified pod (FOUP). Of course, the container 200 that can be used in the embodiment of the present invention is not limited to this. Any container 200 that needs to be cleaned by intaking gas should be included in the scope of the present invention.
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This invention proposes a substrate carrier and an air diffusion module thereof. The air diffusion module comprises a cover, at least one air inlet, an airtight layer, an air diffusion layer and an engaging portion. The at least one air inlet is connected with the cover, and the airtight layer is connected with the cover and the at least one air inlet. Furthermore, the air diffusion layer is connected with the cover via the airtight layer, and the engaging portion engages and tightly connected with the cover, the at least one air inlet and the air diffusion layer. The engaging portion is configured on the substrate carrier as a semiconductor container.
Description
TECHNICAL FIELD[0001]The present invention relates to a semiconductor substrate carrier and diffusion module thereof, and more particularly, to a substrate carrier and its air diffusion module for achieving clean effect by uniform flow gas in air chamber of the substrate carrier.BACKGROUND OF RELATED ARTS[0002]Substrate and reticle are indispensable parts in semiconductor technology. Since the semiconductor structure is essentially a highly precise structure, the requirement for cleanliness in the manufacturing process per se are extremely fulfilled.[0003]Substrate plays an important role in being a base material for all semiconductor components. It includes common silicon substrate (such as wafer), glass substrate, ceramic substrate and even sapphire substrate. In the final microstructure produced by semiconductor fabrication are micron or even nano-scale structure, the manufacturing processes need to be operated under extremely precise environment, without any small particles atta...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/673H01L21/677
CPCH01L21/67393H01L21/67772H01L21/67766H01L21/67373H01L21/67386H01L21/67376H01L21/67389H01L21/67379B65D85/30H01L21/67017H01L21/67126H01L21/67769
Inventor CHIU, MING-CHIENLIN, CHIH-MINGLEE, PO-TINGCHU, YU-CHEN
Owner GUDENG PRECISION IND CO LTD