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Substrate treating apparatus

a technology for treating apparatus and substrates, which is applied in the direction of ohmic-resistance heating, electric/magnetic/electromagnetic heating, and cleaning using liquids. it can solve the problems of insufficient drying performance and drawback of isopropyl alcohol contained in the inert gas condensing of the treating tank, so as to reduce the temperature of the treating liquid quickly and take a long time to cool the liquid

Inactive Publication Date: 2012-05-15
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]This invention has been made having regard to the state of the art noted above, and its object is provide a substrate treating apparatus that can prevent condensation of an organic solvent such as isopropyl alcohol, thereby avoiding insufficient drying performance.
[0010]According to this invention, the control device causes the tank temperature control device and the chamber temperature control device to perform heating treatment at least while the inert gas containing the organic solvent is supplied from the supply device. It is thus possible to prevent the organic solvent supplied into the chamber from condensing in the chamber and treating tank. As a result, the concentration of the isopropyl alcohol in the chamber does not decrease, thereby avoiding insufficient drying performance.
[0014]Once the treating liquid stored in the treating tank is heated for treatment of the substrates, it will take a very long time to cool the liquid by relying on natural heat dissipation. The cooling of the treating liquid may be assisted by cooling the treating tank with the tank temperature control device and chamber temperature control device, thereby lowering the temperature of the treating liquid quickly.

Problems solved by technology

In the conventional apparatus, when the treating tank stores deionized water, the treating tank itself is at a low temperature, resulting in a drawback of the isopropyl alcohol contained in the inert gas condensing on the treating tank.
Such condensation lowers the density of the isopropyl alcohol supplied into the chamber, so that the isopropyl alcohol cannot fully replace the deionized water adhering to the substrates, and thus a possibility of insufficient drying performance.
When not only the treating tank but the chamber itself lowers in temperature, the isopropyl alcohol may condense in the chamber, causing the same problem as above.

Method used

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Examples

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Embodiment Construction

[0020]An embodiment of this invention will be described in detail hereinafter with reference to the drawings.

[0021]FIG. 1 is a block diagram showing an outline of a substrate treating apparatus according to the invention.

[0022]A treating tank 1 stores a treating liquid, and receives wafers W to be immersed in the treating liquid for cleaning treatment. The treating tank 1 includes an inner tank 3 and an outer tank 5. The inner tank 3 has jet pipes 7 disposed at opposite sides in the bottom thereof for supplying the treating liquid into the inner tank 3, and an outlet 9 formed centrally of the bottom for discharging the treating liquid from the inner tank 3. The outer tank 5 collects and discharges the treating liquid overflowing the inner tank 3. The entire treating tank 1 is enclosed in a chamber 11. The chamber 11 has a top opening 13 openable and closable by a shutter 15. The chamber 11 has a space and height enough to form a wait position WP above the treating tank 1 for tempora...

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PUM

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Abstract

A substrate treating apparatus for treating substrates with a treating liquid is disclosed. The apparatus includes a treating tank for storing the treating liquid, and treating the substrates as immersed in the treating liquid, a chamber surrounding the treating tank, a supply device for supplying an inert gas containing an organic solvent into the chamber, a lift mechanism vertically movable, while supporting the substrates, between a process position in the treating tank and a wait position above the treating tank and inside the chamber, a tank temperature control device for controlling temperature of the treating tank, a chamber temperature control device for controlling temperature of the chamber, and a control device for causing the tank temperature control device and the chamber temperature control device to perform heating treatment at least while the inert gas containing the organic solvent is supplied from the supply device.

Description

BACKGROUND OF THE INVENTION[0001](1) Field of the Invention[0002]This invention relates a substrate treating apparatus for treating substrates such as semiconductor wafers or glass substrates for liquid crystal displays (hereinafter called simply substrates) with treating liquids such as deionized water and chemicals. More particularly, the invention relates to a technique for performing drying treatment of substrates by supplying an inert gas such as nitrogen gas containing an organic solvent such as isopropyl alcohol.[0003](2) Description of the Related Art[0004]A conventional substrate treating apparatus of this type includes a treating tank for storing treating liquids and receiving substrates for treatment, a chamber surrounding the treating tank, a lift mechanism for supporting the substrates and vertically movable between a process position inside the treating tank and a wait position above the treating tank and inside the chamber, and nozzles disposed in upper positions insi...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05B1/02
CPCH01L21/67028H01L21/67248H01L21/306
Inventor AIHARA, TOMOAKI
Owner DAINIPPON SCREEN MTG CO LTD
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