Heat dissipation unit for a wireless network device

Abstract

According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Description

FIELD[0001]Embodiments of the invention relate to the field of communications, and in particular, to a heat dissipation unit for a wireless network device.GENERAL BACKGROUND[0002]Over the last decade or so, electronic devices responsible for establishing and maintaining wireless connectivity within a wireless network have increased in complexity. For instance, wireless electronic devices now support greater processing speeds and provide greater functionality. As a by-product of this increase in complexity, the amount of heat generated by processors and other circuitry forming the wireless electronic device has increased as well. Without proper heat dissipation, circuitry within these wireless electronic devices will exceed thermal thresholds more often, which will likely cause the device to operate less efficiently.[0003]Currently, a number of heat dissipation measures are used for discharging heat from circuitry within a wireless network device. For example, heat sinks are one mean...

AI Technical Summary

Problems solved by technology

Over the last decade or so, electronic devices responsible for establishing and maintaining wireless connectivity within a wireless network have increased in complexity.

As a by-product of this increase in complexity, the amount of heat generated by processors and other circuitry forming the wireless electronic device has increased as well.

Without proper heat dissipation, circuitry within these wireless electronic devices will exceed thermal thresholds more often, which will likely cause the device to operate less efficiently.

However, in order to provide proper cooling for more advanced electronic circuitry, it is likely that multiple conventional heat sinks of different sizes will need to be deployed, which increases the cost of manufacture and is detrimental from a design perspective in that larger casings would be required in order to provide sufficient airflow for these heat sinks.

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