Sleeve for a punch assembly
a technology for assembly sleeves and punches, which is applied in the field of sleeves for punch assemblies, can solve the problems of high tool wear cost, less ideal punch/die clearance, and high frequency of “chipping” the punch or die cutting edge, and achieve the effects of reducing the elastic deflection of the draw stud, reducing the bending moment, and adding rigidity to the draw stud
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024]While the invention may be susceptible to embodiment in different forms, there is shown in the drawings, and herein will be described in detail, a specific embodiment with the understanding that the present disclosure is to be considered an exemplification of the principles of the invention, and is not intended to limit the invention to that as illustrated and described herein. Therefore, unless otherwise noted, features disclosed herein may be combined together to form additional combinations that were not otherwise shown for purposes of brevity.
[0025]A punch assembly 20 is provided which includes a punch 22, a sleeve 24, a draw stud 26 and a die 28. The punch assembly 20 is used to punch a hole through a workpiece 30, such as metal, such as mild steel and stainless steel, fiberglass, plastic, etc. The punch assembly 20 is specially designed to also be able to punch 10-gauge stainless steel. The punch assembly 20 can be used to punch holes in the workpiece 30 up to 4.5″ diame...
PUM
Property | Measurement | Unit |
---|---|---|
thick | aaaaa | aaaaa |
included angle | aaaaa | aaaaa |
angle | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com