Electroless plating method using halide
a technology of halide and electroless plating, which is applied in the field of electroless plating methods, can solve the problems of affecting the physical health of the human body or neighboring devices or instruments, the use of ito coatings, and the inability to meet the requirements of the application of the metal, so as to promote polymer crosslinking, increase the hydrophilicity of exposed regions, and promote strong adhesion of the polymeric layer
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##ventive example 1
INVENTIVE EXAMPLE 1
[0227]Polymer A was dissolved in dichloromethane solvent to 15% solids as described above and 3.3 g of this Polymer A solution was added to 1.7 g of cyclopentanone. The resulting reactive composition was spin coated on a PET substrate to form a precursor article. After being dried, the resulting polymeric layer was exposed through a mask to an Oriel high intensity UV lamp for 600 seconds. The exposed polymeric layer was then immersed in a 0.4 molar silver nitrate bath for 3 minutes, rinsed in distilled water for 2 minutes, immersed in a 1 weight % sodium bromide bath for 5 minutes, rinsed in distilled water for 2 minutes, and then dried with compressed nitrogen. The treated polymeric layer was immersed in electroless copper bath C1 for 3 minutes at 20° C., washed in distilled water for 4 minutes, and then dried with compressed nitrogen. The resulting copper pattern exhibited high conductivity in both the large exposed regions and the fine exposed regions (lines) t...
##ventive example 2
INVENTIVE EXAMPLE 2
[0230]Polymer K was dissolved in dichloromethane solvent to 15% solids as per the above method. 3.3 g of this polymer solution was added to 1.7 g cyclopentanone and spin coated onto a PET substrate to form a precursor article. After being dried, the resulting polymeric layer was exposed through a mask to an Oriel high intensity UV lamp for 600 seconds. The exposed polymeric layer was then immersed in a 0.4 molar silver nitrate bath for 3 minutes, rinsed in distilled water for 2 minutes, immersed in a 1 weight % sodium bromide bath for 5 minutes, rinsed in distilled water for 2 minutes, and then dried with compressed nitrogen. The treated polymeric layer was immersed in electroless copper bath Cl for 3 minutes at 20° C., washed in distilled water for 4 minutes, and then dried with compressed nitrogen. The resulting copper pattern exhibited high conductivity in both the large exposed regions and the fine exposed regions (lines) that were 5 to 6 μm in width in the re...
##ventive example 3
INVENTIVE EXAMPLE 3
[0232]Polymer A was dissolved in dichloromethane solvent to 15% solids as described above and 3.3 g of this Polymer A solution was added to 1.7 g of cyclopentanone. The resulting reactive composition was spin coated onto a PET substrate to form a precursor article. After being dried, the resulting polymeric layer was exposed through a mask to an Oriel high intensity UV lamp for 600 seconds. The exposed polymeric layer was then immersed in a 0.4 molar silver nitrate bath for 3 minutes, rinsed in distilled water for 2 minutes, immersed in a 1 weight % sodium bromide bath for 5 minutes, rinsed in distilled water for 2 minutes, and then dried with compressed nitrogen. The treated polymeric layer was uniformly exposed to a hand held 365 nm lamp for 20 minutes, immersed in a 1 weight % dimethylamine borane (DMAB) bath for 5 minutes, rinsed in distilled water for 2 minutes, and dried with compressed nitrogen. The polymeric layer was then immersed in electroless copper ba...
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