Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

4 results about "Structural factor" patented technology

Geothermal caprock evaluation modeling method

The application discloses a geothermal caprock evaluation modeling method and belongs to the technical field of geothermal resource exploration. In view of the problems that existing caprock evaluation standards are uneven, subjective and lack of quantitative coupling of structural factors and calibration of measured data, the application firstly acquires caprock physical properties and structural data; secondly, a single-factor evaluation model based on physical mechanism is constructed for lithology, thickness, permeability and thermal conductivity; on this basis, a structure-mechanical-integrity coupling model is constructed, which includes basic structure scores, fracture risk indexes and plastic self-repairing capacity factors; finally, by using observation data such as historical breakthrough pressure and leakage events, key parameters in the above model are calibrated through regression and Bayesian methods. The method forms a unified and portable caprock evaluation basic model system, reduces subjectivity, and improves the stability and interpretability of the evaluation results.
Owner:INST OF GEOMECHANICS

Processing apparatus, system, method, and program for calculating a structural factor

A system capable of calculating a structure factor of a thin film formed on a substrate includes a measurement data acquiring section, a total scattering data calculating section, and a structure factor calculating section. The processing apparatus is configured to be capable of calculating a structure factor of a film formed on a substrate. The total scattering data calculating section acquires first total scattering data Isp and second total scattering data Isub from the measurement data acquiring section, and calculates total scattering data ITF of only a film portion based thereon. The total scattering data ITF of only the film portion is determined by subtracting a product of the second total scattering data Isub and an absorption factor Asub of the substrate from the first total scattering data Isp.
Owner:RIGAKU CORP

Method for determining a durability design allowable stress for an aircraft metal structure

This invention belongs to the field of aircraft structural performance evaluation technology, specifically involving a method for determining the allowable stress for durability design of aircraft metal structures. First, the baseline local allowable stress is calculated under a given material and load spectrum using fatigue analysis. Considering actual structural factors, an equivalent stress concentration factor is introduced to correct the baseline local allowable stress. Furthermore, a stress correction factor is introduced based on the correction of theoretical analysis results using fatigue tests. Considering reliability requirements, a fatigue uncertainty factor is also introduced, thereby establishing a set of analogous calculation formulas to determine the allowable stress for durability design. The calculation formula is: where, [σ max,0 [K] is the reference local allowable stress. te C is the equivalent stress concentration factor, SCF is the stress correction factor, FSF is the fatigue uncertainty factor, and C is the stress concentration factor. load This is the load conversion factor. This invention simplifies the fatigue test matrix while ensuring the accuracy of theoretical analysis; it can quickly determine whether the structural fatigue margin meets the requirements, thus enabling durability analysis to cover the entire load-bearing structure of the aircraft.
Owner:CHENGDU AIRCRAFT DESIGN INST OF AVIATION IND CORP OF CHINA

PROCESSING DEVICE, SYSTEM, METHOD, AND PROGRAM FOR CALCULATING A STRUCTURAL FACTOR

According to the present invention, a processing device, a system, a method, and a program are provided that are capable of calculating a structure factor of a thin film formed on a substrate. A processing device 100 mainly comprises a measurement data acquisition section 110, a total dispersion data calculation section 120, and a structure factor calculation section 130. The processing device 100 is configured to be capable of calculating a structure factor of a film formed on a substrate. The total dispersion data calculation section 120 acquires initial total dispersion data I sp and second total dispersion data I sub from the measurement data acquisition section 110, and calculates total dispersion data I TF from only one film segment based on it. The total dispersion data I TF from only the film segment by subtracting a product of the second total dispersion data Isub and an absorption factor A sub of the substrate from the first total dispersion data I sp certainly.
Owner:RIGAKU CORP