Method for making heat radiation treating of device with radiation structure in communication equipment
A technology of heat dissipation structure and communication equipment, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of mutual interference, short circuit of single board, easy detachment of bolts, etc., achieves low possibility of falling off, meets design requirements, and has good heat dissipation effect. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0031] The invention mainly provides a heat dissipation method for a device used on a printed circuit board and having a heat dissipation structure. First, the device with heat dissipation structure is arranged on the printed circuit board, so that the other side opposite to the side with the heat dissipation structure is matched with the printed circuit board; then a radiator is arranged on the heat dissipation structure of the device, and the radiator is fixed on the printed circuit board. The device is pressed against the board to keep the device in effective contact with the printed circuit board.
[0032] This embodiment takes a linear voltage regulator as an example to describe the present invention in detail:
[0033] Referring to Figure 2, first place the linear voltage regulator on the printed circuit board (PCB) 1, with the plastic side of the voltage regulator 2 facing down, stick it on the printed circuit board (PCB) 1, and the side with the metal heat sink facing ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 