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Ag-Al-Cu-Ni-Sn series lead-free soldering tin

A lead-free solder, ag-al-cu-ni-sn technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problem of high cost and achieve the effect of low cost and simple composition

Inactive Publication Date: 2008-01-30
吴江海博科技创业投资有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most widely used Sn 96.5 Ag 3.5 The melting point of lead-free solder is 221 ° C, because it contains silver, the cost is higher

Method used

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  • Ag-Al-Cu-Ni-Sn series lead-free soldering tin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1) Use pure Ag, pure Al, pure Cu, pure Ni, and pure Sn as raw materials, prepare 1kg alloy material by weight percentage, wherein 10.0gAg, 0.01gAl, 20.0gCu, 5.0g Ni, and the rest are Sn and unavoidable impurities;

[0024] 2) Put the alloy material into the vacuum induction melting furnace, vacuumize it, and then fill it with argon;

[0025] 3) Adjust the power of the induction melting furnace so that the furnace temperature reaches 950°C for smelting. After smelting, it is cast into a rod with a diameter of 28 mm, and machined into a tensile sample with a diameter of 5 mm. Samples are taken for differential scanning calorimetry (DSC) For the measurement of the curve, the composition of the lead-free solder sample is 1.0% Ag, 0.001% Al, 2.0% Cu, 0.5% Ni, and the rest is Sn and unavoidable impurities.

[0026] The melting point of the sample measured by DSC is 219.0°C, the tensile strength is 52 MPa, and the elongation is 21.1%. Figure 1 is the DSC curve of the sample du...

Embodiment 2

[0028] 1) Using pure Ag, pure Al, pure Cu, pure Ni, and pure Sn as raw materials, prepare 1kg alloy material by weight percentage, wherein 10.0gAg, 1.0gAl, 20.0gCu, 2.0gNi, and the rest are Sn and unavoidable impurities;

[0029] 2) Put the alloy material into the vacuum induction melting furnace, vacuumize it, and then fill it with argon;

[0030] 3) Adjust the power of the induction melting furnace so that the furnace temperature reaches 900°C for smelting. After smelting, it is cast into a rod with a diameter of 28 mm, and machined into a tensile sample with a diameter of 5 mm. Samples are taken for differential scanning calorimetry (DSC) For the measurement of the curve, the composition of the lead-free solder sample is 1.0% Ag, 0.1% Al, 2.0% Cu, 0.2% Ni, and the rest is Sn and unavoidable impurities.

[0031] The melting point of the sample measured by DSC is 219.9°C, the tensile strength is 13MPa, and the elongation is 33.3%. Figure 2 is the DSC curve of the sample durin...

Embodiment 3

[0033] 1) Use pure Ag, pure Al, pure Cu, pure Ni, and pure Sn as raw materials, prepare 1kg of alloy material by weight percentage, wherein 10.0gAg, 5.0gAl, 20.0gCu, 0.01g Ni, and the rest are Sn and unavoidable impurities;

[0034] 2) Put the alloy material into the vacuum induction melting furnace, vacuumize it, and then fill it with argon;

[0035] 3) Adjust the power of the induction melting furnace so that the furnace temperature reaches 900°C for smelting. After smelting, it is cast into a rod with a diameter of 28 mm, and machined into a tensile sample with a diameter of 5 mm. Samples are taken for differential scanning calorimetry (DSC) For the measurement of the curve, the composition of the lead-free solder sample is 1.0% Ag, 0.5% Al, 2.0% Cu, 0.001% Ni, and the rest is Sn and unavoidable impurities.

[0036] The melting point of the sample measured by DSC is 220.0°C, the tensile strength is 11.6 MPa, and the elongation is 25.0%. Figure 3 is the DSC curve of the samp...

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Abstract

The present invention relates to an Ag-Al-Cu-Ni-Sn series leadless solder. Its composition includes (by wt%) 0.1-1.5% of Ag, 0.001-1.0% of Al, 1.6-10.0% of Cu, 0.001-1.5% of nickel, the rest is Sn and inevitable impurity. Its melting point is 210-220deg.C.

Description

technical field [0001] The invention relates to a solder material, in particular to an Ag-Al-Cu-Ni-Sn lead-free solder suitable for the fields of electronic assembly and packaging, electrical equipment, communication equipment and the like. Background technique [0002] use Sn 63 Pb 37 Lead is inevitably contained in electronic products made of solder. When such electronic products are discarded or recycled, they will pollute the environment and bring harm to human health. In order to eliminate the pollution of lead in waste electronic products and the harm to human health, the Ministry of Information Industry of my country formulated the "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" in March 2003, which clearly stipulates: "Producers should take measures to gradually reduce And eliminate the content of lead, mercury, cadmium, hexavalent chromium, polymeric brominated biphenyl (PBB), polymeric brominated biphenyl et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 黄德欢李宗全夏志平周颖
Owner 吴江海博科技创业投资有限公司
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