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Opening/closing mechanism for vacuum processing apparatus, and vacuum processing apparatus

A technology of vacuum processing device and opening and closing mechanism, which is applied in the direction of valve device, vacuum evaporation coating, mechanical equipment, etc., and can solve the problems of increased manufacturing cost of the device

Inactive Publication Date: 2008-04-16
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, there is a limit in miniaturization, and at the same time, there is a problem that the manufacturing cost of the device increases.

Method used

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  • Opening/closing mechanism for vacuum processing apparatus, and vacuum processing apparatus
  • Opening/closing mechanism for vacuum processing apparatus, and vacuum processing apparatus
  • Opening/closing mechanism for vacuum processing apparatus, and vacuum processing apparatus

Examples

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Embodiment Construction

[0019] Next, with reference to the drawings, details of the present invention will be described with respect to a first embodiment. figure 1 It is an overall schematic configuration diagram showing the vacuum processing apparatus according to the first embodiment of the present invention. As shown in the figure, a vacuum transfer chamber 10 is provided in the central portion of the vacuum processing apparatus 1 . A plurality of (six in this embodiment) vacuum processing chambers (processing chambers) 11 to 16 are arranged along the periphery of the vacuum transfer chamber 10 .

[0020] On the front side (lower side in the figure) of the vacuum transfer chamber 10, two load lock chambers 17 are provided. On the further front side (lower side in the figure) of these load lock chambers 17, a transfer chamber 18 for transferring the semiconductor wafer W in the atmosphere is provided. In addition, on the further front side (lower side in the figure) of the transfer chamber 18, a...

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Abstract

An opening / closing mechanism for a vacuum processing apparatus comprises a link mechanism comprising a supporting member having first and second valve elements for closing first and second opening portions, and a base end side member rotatably attached at a rear edge portion side of the supporting member through a rotation axis, a guide mechanism rotatably supporting the supporting member to a horizontal moving direction of the first and second valve elements while restricting the vertical moving range of the supporting member, first and second guide members which move the rotation axis of the link mechanism to a vertical direction and at the top portion to the horizontal direction, and first and second vertical moving mechanisms which vertically move the first guide member, the second guide member and the base edge side member.

Description

technical field [0001] The present invention relates to a vacuum processing apparatus for performing vacuum processing such as etching processing or film formation processing of a processing object such as a semiconductor wafer in a vacuum state, and an opening and closing mechanism for a vacuum processing apparatus for opening and closing an opening of the vacuum processing apparatus. Background technique [0002] At present, there are known vacuum processing apparatuses that perform vacuum processing, for example, etching processing or film forming processing, for example, on an object to be processed such as a semiconductor wafer in a vacuum state. As such a vacuum processing apparatus, there is known a structure in which a transfer mechanism is provided in a vacuum chamber (vacuum transfer chamber), and a plurality of vacuum processing chambers (processing chambers) are connected to the vacuum transfer chamber. ), can improve the transfer efficiency for processing. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/20H01L21/306H01L21/31C23C16/00C23C14/00C23F4/00F16K51/02
CPCH01L21/67017H01L21/67772H01L21/68742
Inventor 近藤圭祐
Owner TOKYO ELECTRON LTD