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Pneumatic type platform cover-opening mechanism

A pneumatic, platform technology, used in electrical components, conveyor objects, semiconductor/solid-state device manufacturing, etc., can solve problems such as slow opening and unsafety, and achieve the effect of avoiding equipment collisions

Active Publication Date: 2008-04-23
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the 300mm platform system, the mass of the platform cover is up to 60Kg, and the diameter of the cover is close to 1 meter. During operation, the opening speed is slow and unsafe

Method used

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  • Pneumatic type platform cover-opening mechanism
  • Pneumatic type platform cover-opening mechanism
  • Pneumatic type platform cover-opening mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0020] (1) In order to fully disclose the technical content of the present invention, the operating principle of the opening and closing of the platform cover of the present invention will be described below in conjunction with the accompanying drawings.

[0021] Such as Figure 4 , Figure 5 As shown, the length of the cylinder 2 is variable. In the figure, the inner circle is a circle formed by the total length of the cylinder 2 at zero stroke as the radius, and the axis center of the upper shaft 6 as the center; the radius of the outer circle is equal to the total length of the cylinder 2 at the full stroke. , the center of the circle is also the axis of the upper axis 6. When the platform cover 1 rotates around the lower shaft 7, the cylinder 2 rotates around the upper shaft, and the length of the cylinder is constantly changing,...

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PUM

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Abstract

This invention relates to a cover-opening unit for processing semiconductor wafers including: a pneumatic device for opening and closing platform covers and a connecting rod, in which, said cover and the cavity of the transmission chamber are connected by the connecting rod, which can open and close the platform covers quickly and smoothly, when power or gas cut-off happens in the process of opening the cover, the cover will not screw down quickly so as to avoid colliding of the devices, if the power or gas cut-off happens after the cover is opened completely, the cover will remain unchanged.

Description

technical field [0001] The invention relates to a platform cover opening mechanism for semiconductor wafer processing, in particular to a pneumatic platform cover opening mechanism. Background technique [0002] During semiconductor wafer processing, the wafer is transported to the load lock chamber, and then the vacuum robot in the transfer chamber takes the wafer out of the load lock chamber and transfers the wafer to the wafer processing chamber connected to the chamber, thereby Various process processes are performed on the wafer. After each process is completed, the vacuum robot removes the wafer from the processing chamber and transports it back to the load lock chamber. figure 1 It is a schematic diagram of the platform system, including the load lock chamber, platform cover, transfer chamber, cover opening mechanism, and the vacuum manipulator (located in the transfer chamber) and front-end transfer unit (located in the front end of the load lock chamber and connect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67H01L21/677
Inventor 董博宇
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD