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Electrostatic chuck

An electrostatic chuck and access technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as insufficient heat conduction of electrostatic chucks

Active Publication Date: 2008-05-14
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, the surrounding area of ​​the wafer is not sensitive to temperature, and the heat conduction effect of the electrostatic chuck cannot be fully obtained

Method used

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  • Electrostatic chuck
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Embodiment Construction

[0025] The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the present invention. Therefore All equivalent technical solutions also belong to the category of the present invention, and the scope of patent protection of the present invention should be defined by each claim.

[0026] The electrostatic chuck of the present invention includes a ceramic insulating layer and a base, a grooved gas passage is provided on the ceramic layer, and 3 circular passages 6 are connected to 8 radial passages 5 arranged symmetrically on the insulating layer. 16 radiation passages 2 are evenly arranged between the circular passage 6 of the outer circle and the outer edge 1 of the electrostatic chuck, the radiation passages 2 communicate with the circular passage 6 of...

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Abstract

The static clamping chuck includes insulating layer and base. Characters of the chuck are that there are some circular paths set up on insulating layer connected to some radial paths arranged symmetrically; some radial paths are arranged evenly between circular path in outmost circle and external rim of static chuck, which are connected to each other; center air holes are set up on central cross points on radial paths; external holes are setup on conjoining place between radial paths and circular paths. The radial paths at peripheral part increase circulation of gas at peripheral part effectively so as to guarantee that temperature of peripheral of wafer can be lowered adequately. Thus, even temperature reaches whole plane of wafer. Gas goes out from central air hole and some peripheral air holes. The invention diffuses gas quickly, and raises evenness of temperature.

Description

technical field [0001] The invention relates to semiconductor manufacturing equipment, in particular to an electrostatic chuck for fixing and supporting wafers in semiconductor manufacturing. Background technique [0002] In the semiconductor manufacturing process and LCD manufacturing process, in order to fix and support the wafer and avoid movement or misalignment during processing, an electrostatic chuck (ESC: Electrostatic chuck for short) is often used. The electrostatic chuck uses electrostatic attraction to hold the wafer, which has many advantages over the mechanical chuck and vacuum chuck used before. The electrostatic chuck reduces the damage of the wafer caused by pressure, collision and other reasons when using the mechanical chuck; increases the area where the wafer can be processed effectively; reduces the deposition of corrosion particles on the wafer surface; makes the wafer and the chuck better Conduct heat conduction; and can work in a vacuum environment, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
Inventor 吉美爱
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD