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Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components

An adhesive layer, plane component technology, applied in the direction of assembling printed circuits, electrical components, electrical components, etc. with electrical components, can solve the problem that components cannot be removed, it is not suitable for filling components below the level of the wafer, and it is not enough to overcome adhesion. Problems such as the adhesive force of the agent layer

Inactive Publication Date: 2008-09-03
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the planar wetting of the bottom side of the component by the adhesive usually prevents the component from being removed from the adhesive layer, because the holding force of the holding means, usually by means of vacuum, is not sufficient for the component to overcome the adhesion of the adhesive layer to the component. Adhesion on
[0012] However, the above-mentioned method in which the components are quickly lowered onto an adhesive film made of adhesive and / or flux is not suitable for so-called Wafer Level Underfilled Packages.

Method used

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  • Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components
  • Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components
  • Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components

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Embodiment Construction

[0044] It should be noted here that the reference signs of the corresponding parts in the drawings differ only in their first digits.

[0045] Figure 1a shows a die member 100 having two connectors 101a and 101b on its surface. The component 100 is fixed by a holding mechanism 110. The holding mechanism 110 is, for example, a so-called pipette. There is a support board 120 under the die 100, and the support board 120 has an adhesive 130 thereon, and the adhesive 130 is coated on the support board 120 in the form of an adhesive layer. In addition, a lifting element 140 is provided, and an ejector pin 141 is formed thereon. The lifting element 140 is positioned relative to the support plate 120 such that the front face of the ejector pin 141 is located in a plane with the flat surface of the support plate 120, wherein the ejector pin 141 passes through the support through a correspondingly formed hole in the support plate 120板120。 Board 120. The ejector pins 141 are regularly distri...

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PUM

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Abstract

An underside of a flat component (100) like a bare die with connectors (100a,100b) on its top side held by a holding device (110) like a sucking pipette is immersed in a layer of adhesive (130), from which the component is pressed away. A lifting device (140) with ejector pins (141) locks onto the underside of the component only partially. Independent claims are also included for the following: (a) A device for applying a layer of adhesive to flat components like bare dies, flip chips or ball grid arrays; (b) and for a device for attaching components like bare dies, flip chips or ball grid arrays on a component carrier.

Description

Technical field [0001] The present invention relates to a method and device for coating an adhesive layer on a planar member, especially a bare chip (Bare Die), a flip chip (Flip Chip) and / or a ball grid array (Ball Grid Array) . Furthermore, the present invention relates to an assembly device for assembling such components on a component support. Background technique [0002] The miniaturization of electronic components, that is, the construction of electronic circuits in the smallest possible space, is based on the fact that highly integrated electronic components are used together with multiple electrical connectors, which are not only arranged On the side of the component, it is also distributed on the bottom of the plane of the component. This can realize a variety of electrical contacts between the component and the component support in a small space. The component support is, for example, a printed circuit board or a substrate. [0003] In the following, components are und...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/30H01L21/58
CPCH05K13/0469H01L24/75H01L24/81H01L24/83H01L2224/73104
Inventor G·施贝尔
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC