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Method and system for thermal process control

A control method and process technology, applied in general control systems, control/regulation systems, temperature control, etc., can solve problems such as error-prone, time-consuming and labor-intensive, and achieve the effect of preventing errors

Active Publication Date: 2008-10-22
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The method of manually adjusting the temperature is not only error-prone, but also time-consuming and labor-intensive.

Method used

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  • Method and system for thermal process control
  • Method and system for thermal process control
  • Method and system for thermal process control

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Embodiment Construction

[0023] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the preferred embodiments are specially cited below, together with the attached drawings Figure 1 to Figure 3 , give a detailed explanation. The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. Wherein, the configuration of each element in the embodiment is for illustration, not for limiting the present invention. In addition, part of the symbols in the figures in the embodiments are repeated for the purpose of simplifying the description, and do not imply the relationship between different embodiments.

[0024] figure 1 A schematic diagram of a manufacturing system according to an embodiment of the invention is shown. The manufacturing system 10 is a thermal processing system that performs thermal processing on semiconductor wafers. The manufacturi...

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Abstract

The invention provides a heating process control method as well as a heating process system. The heating process control method has the following steps: firstly, a gradient coefficient matrix and a first heating model are provided; according to the first heating model, a first process round is executed in the first wafer batch; then, the film thickness of at least one wafer in the first wafer batch is measured; utilizing the gradient coefficient matrix as well as the measured value of the film thickness, a statistic process control analysis is executed; a second heating model is obtained by correcting the first heating model according to the result of the statistic process control analysis; according to the second heating model, a second process round is executed in the second wafer batch. The heating process control method solves the problems existing in prior art, and prevents the error caused by the un-continuous execution of the process rounds.

Description

technical field [0001] The present invention relates to semiconductor manufacturing, and more particularly to a model-based system and method for controlling the heating temperature of a multi-zone heat treatment tool. Background technique [0002] Multi-zone heat treatment machines like furnace tubes are widely used in the semiconductor manufacturing process. For example, an oxidation diffusion high temperature furnace for performing oxidation and diffusion processes. This high-temperature furnace is divided into three or more heating zones to facilitate temperature control or adjustment. [0003] As far as the operation of the oxidation diffusion high temperature furnace is concerned, temperature control is the most important part. For example, when forming a thin film, incorrect reaction temperature will affect the thickness of the formed film, which will cause the electrical drift of the component and reduce the yield. Moreover, during the reaction process, the film i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B13/00G05D23/00G05D23/19H01L21/00
CPCG05B17/02H01L21/67248
Inventor 张永志孙正一郭俊一叶辅焜沈学琪
Owner TAIWAN SEMICON MFG CO LTD