The encapsulation of integrated circuit chip without lead
An integrated circuit and chip packaging technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of increased cost and reduced production efficiency, and achieve the effect of low manufacturing cost and good frequency characteristics
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Embodiment 1
[0029] Firstly, the encapsulation mold 20 is designed and manufactured. Contrasting Fig. 1, this mold is made of polytetrafluoroethylene material, is disc-shaped structure, is provided with a casting groove 21 of a rectangle at its central part, and a die hole 22 is arranged at the center of groove bottom.
[0030] Then design and manufacture the substrate 1, the present embodiment is based on a 0.8 × 0.7mm 2 Encoding chip design. The distribution of positive interconnection lines 4, gold fingers 5 and metal vias 6 on the front side of the substrate is shown in Figure 2, and the distribution of reverse interconnection lines 8, pads 7 and metal vias 6 on the back side of the substrate is shown in Figure 3. It can be seen from the figure that the number of golden fingers 5 on the front side and the number of pads 7 on the back side all surround the chip 3 placed at the center of the front side of the substrate to form a similar rectangular ring.
[0031] After the substrate 1 ...
Embodiment 2
[0034] The packaging mold 20 in this embodiment is the same as the above embodiment, and the substrate 1 is similar to the above embodiment (not shown). Chip is 1.2×1.0mm 2 To decode the chip, brush one side of it with red glue, paste it in the center area 10 of the substrate where the chip is placed, and then bake it in a heating furnace in a nitrogen environment. The heating temperature is controlled at 120°C for 20 minutes.
[0035] Take it out of the furnace after baking, and then bond the integrated circuit chip 3 and the substrate 1, that is, connect one end of the gold wire (bonding wire 2) to the pad on the decoder chip, and the other end to the gold finger 5 on the substrate, see Figure 4 , Figure 5 . All the pads on the chip are connected to all the golden fingers 5 on the substrate correspondingly, and the capping layer 9 is casted after the connection is completed. At this time, put the above-mentioned substrate connected with the chip into the casting tank 21 ...
Embodiment 3
[0037] The packaging mold 20 in this embodiment is basically the same as that in Embodiment 1, except that the casting groove 21 is longer than that in Embodiment 1. The design of the substrate is designed according to the plan of tiling the above two chips of encoding and decoding, the positive interconnection lines and gold fingers on the front side, the anti-interconnection lines and pads on the back side, and the positive and anti-interconnection lines and metallized vias The connections are the same as in Example 1 (the front and back structure diagrams are not drawn).
[0038] Same as the above-mentioned embodiment, the prepared substrate and the chip were connected with red glue, and baked in a heating furnace with a nitrogen environment. The heating temperature was controlled at 130° C. for 25 minutes.
[0039] The baked substrate and chip are taken out of the furnace, and then bonded. Connect one end of the gold wire (bonding wire 2) to the pad on the chip, and the o...
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