Capacitor wiring substrate, decoupling circuit and high frequency circuit
A technology of high-frequency circuits and wiring substrates, applied in the field of capacitors, can solve the problem of not being able to increase the electrostatic capacitance of multilayer capacitors 50, and achieve the effects of low-cost manufacturing methods, high-speed, large-capacity, and low-ESL
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[0080] generate figure 1 The multilayer capacitor 10 of the present invention is shown and Figure 4 In the illustrated conventional laminate 50, the capacitance C and the equivalent series inductance L were measured. Here, both dimensions of the multilayer capacitors 10 and 50 are 3.2 mm×3.2 mm, and a total of 36 first and second through conductors 5 a ( 55 ) and 6 a ( 56 ) are formed in a grid shape. Only the multilayer capacitor 10 has a total of two third and fourth through conductors 5b and 6b formed in the central portion.
[0081] the result of the measurement, Figure 4 In contrast to the illustrated conventional multilayer capacitor 50 where C=7.8 μF and L=20 pH, figure 1 In the illustrated multilayer capacitor 10 of the present invention, C=15 μF and L=8 pH.
[0082] As can be seen from these results, in the multilayer capacitor 10 of the present invention, since the total number of conductors of the first through conductors 5a and the second through conductors 6...
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