Damping material
A technology of vibration-damping materials and vibrating bodies, which is applied in the field of vibration-damping materials and can solve problems such as insufficient lightness and insufficient lightness of vibration-damping plates
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0073]Mix the following ingredients uniformly and then filter to produce adhesive latex, water-acrylic adhesive latex [DAINIPPON INK AND CHEMICALS (INCORPORATED) product name: ボンコ一ト350 (VONCOAT 350) Acrylic adhesive component (resin component): 50% by weight] 90 parts by weight, water-urethane adhesive latex [manufactured by DAINIPPON INK AND CHEMICALS, INCORPORATED) Trade name: Hardran HW-930 ( HYDRAN HW-930), polyurethane adhesive component (resin component): 50% by weight] 10 parts by weight, epoxy crosslinking agent (DAINIPPON INK AND CHEMICALS, INCORPORATED) product trade name: CR -5L) 3 parts by weight, ammonium chloride foaming agent (manufactured by Dainippon Chemicals (DAINIPPON INK AND CHEMICALS, INCORPORATED) trade name: F-1) 5 parts by weight, polysiloxane foam stabilizer (Dainippon (DAINIPPON INK AND CHEMICALS, INCORPORATED) trade name: Boncoat NBA-1 (VONCOATNBA-1) 0.5 parts by weight and carboxymethyl cellulose aqueous solution (DAICEL CHEMICAL INDUSTRIES, LTD.) , 4%...
Embodiment 2
[0079] Use 21 parts by weight of azoformamide instead of 14 parts by weight, use 2.6mm instead of 1.3mm for the thickness of the foamable resin plate, and use acceleration voltages of 500kV and 3.8Mrad instead of acceleration voltages of 800kV and 2.4Mrad to irradiate electrons on both sides of the foamable resin plate. Except for radiation, the same procedure as in Example 1 was used to obtain a thermoplastic resin foamed board. Among them, the thickness of the thermoplastic resin foam board is 8.6mm and the density is 0.033g / cm 3 . The Young's modulus of the thermoplastic resin foam board was 1.40 MPa. Furthermore, on one side of the above-mentioned thermoplastic resin foam board, the foamed adhesive layer prepared in the same manner as in Example 1 was laminated and integrated by the same method as in Example 1 to obtain a vibration damping material with a thickness of 10.5 mm. .
Embodiment 3
[0081] The following components were supplied to an extruder, melted and kneaded, and extruded to obtain a foamable resin board with a thickness of 1.2 mm. Polypropylene resin composed of ethylene-propylene random copolymer (product name of Chisso Corporation (Chisso Corporation): XK0235) 45 parts by weight and 15 parts by weight of isotactic polypropylene (product name of Idemitsu Corporation: SH152), straight chain Low-density polyethylene (made by Idemitsu Co., Ltd., trade name: 0238CN) 40 parts by weight, 6.8 parts by weight of azoformamide, crosslinking agent (made by Kyoei Chemical Co., Ltd. trade name: TND-23H), 3 parts by weight, antioxidant A ( Product name manufactured by Asahi Denka: ADEKASTAB AO-60 (ADEKASTAB AO-60)) 1 part by weight, antioxidant B (product name manufactured by Asahi Denka: ADEKASTAB CDA-1 (ADEKASTAB CDA-1)) 0.5 part by weight and antioxidant C (trade name of Ouchi Shinko Chemical Co., Ltd.: ノクラツク400S (NOCRAC400S)) 0.5 parts by weight.
[0082] Electro...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com