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Radiating apparatus

A technology of heat dissipation device and heat dissipation body, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc. It can solve the problems affecting the operation performance of electronic components, the central column and the heat conduction wall cannot be tightly combined, and achieve heat dissipation The effect of performance improvement

Inactive Publication Date: 2009-01-28
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the roughness of the outer peripheral surface of the central column and the inner peripheral surface of the heat-conducting wall, the central column and the heat-conducting wall cannot be tightly combined, so there is a large thermal resistance between the central column and the heat-conducting wall. The heat generated cannot be quickly transferred from the central column to the heat-conducting wall and dissipated, so that the heat accumulates in the electronic components and the central column, which affects the operating performance of the electronic components

Method used

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  • Radiating apparatus
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Embodiment Construction

[0012] see figure 1 , the heat dissipation device includes a heat sink and a fixing device 50 for fixing the heat sink to a heat-generating electronic component (not shown) mounted on a circuit board (not shown). The radiator includes a heat conductor 10 and a radiator 30 combined with the heat conductor 10 .

[0013] The heat conductor 10 has high thermal conductivity, and includes a disc-shaped heat absorbing portion 11 with a larger diameter and a cylindrical central body 13 with a smaller diameter extending vertically from a surface of the heat absorbing portion 11 . The central body 13 is dug with four grooves 135 evenly distributed to its outer peripheral surface, so that the central body 13 has a connecting portion 137 between the grooves 135 and the heat absorbing portion 11, and a core body 131 surrounded by the grooves 135 And the partition wall 133 between two adjacent grooves 135 .

[0014] The heat sink 30 includes a cylindrical hollow heat conduction wall 31 an...

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Abstract

The heat sink includes radiator and heat conductor integrated inside the radiator. The radiator includes heat-conducting wall and heat elimination fins extended from the heat-conducting wall. Phase change medium is filled between the heat conductor and the heat-conducting wall. Thus, through Phase change medium, quantity of heat generated by working electronic components can be transferred from the heat conductor to the radiator quickly to be emitted. The invention raises heat dispersion.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for assisting electronic components in heat dissipation. 【Background technique】 [0002] As we all know, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the heat-generating electronic component from rising due to the accumulation of heat, thereby causing unstable operation, the electronic component usually needs to be equipped with a heat dissipation device to assist in heat dissipation. [0003] Usually, a heat dissipation device includes a solid central column for heat conduction and a heat dissipation body sheathed on the periphery of the central column. fins. The central column is combined into the hollow heat-conducting wall of the radiator by means of interference fit or the like. One end of the central column is provided with a heat absorbing portion that can be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34H01L23/367H01L23/427G06F1/20H05K7/20
Inventor 陈俊吉周世文武湛
Owner FU ZHUN PRECISION IND SHENZHEN