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Electroplating device

A technology of electroplating device and electroplating solution, which can be applied to circuits, electrical components, electrical solid devices, etc., and can solve the problem of spending a lot of labor.

Inactive Publication Date: 2009-02-04
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, if the composition of the plating solution used is different, the anodes used in that plating bath are also different and must be replaced
That is, there is a problem that a lot of labor is required for maintenance such as plating solution management and bath management.

Method used

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  • Electroplating device
  • Electroplating device
  • Electroplating device

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0023] Fig. 1 is a layout diagram schematically showing the function of a solder plating line of a plating apparatus for practicing the present invention. In this solder plating line, a pre-dipping bath 273 , a first plating bath 274 , a second plating bath 275 , a third plating bath 276 , and a bath 277 for washing are provided under a transport rail 272 . And, send 1 span at a time with cross-feed type pusher 271, use these baths in conductive member 21 (refer to Figure 4 ) is the same as in the past for forming a plating film.

[0024] In the present invention, as a first embodiment, a necessary plating solution storage bath is provided corresponding to the plating bath. For example, as shown in Figure 1, on the 1st electroplating bath 274, the electroplating solution storage bath is not provided, but the 1st electroplating solution storage bath 279 that the 2nd electroplating bath 275 is used and the 2nd that the 3rd electroplating bath 276 uses respectively. Plating sol...

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PUM

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Abstract

The present invention provides an easy solder plating apparatus to satisfy the requirement of forming continuously plural combinations of plated films with a single transportation rail. The plating apparatus comprises several plating bath tanks under the transportation rail and a plating liquid storage tank beside the plating bath tank. The sort of plated film to be formed on an electro-conductive member 21 can be selected by means of moving the plating liquid back and forth between the plating bath tank and the plating liquid storage tank. Thus, several combinations of plated films can be formed continuously on an electro-conductive member 21 with a single transportation rail.

Description

technical field [0001] The present invention relates to an electroplating device, and relates to an electroplating device which connects electroplating baths and corresponding electroplating solution storage tanks with these baths so that the electroplating solution can be transferred. Moreover, it relates to an electroplating device capable of forming a single layer or at least two or more combinations of metal material electroplating films by transferring the electroplating solution between two baths. Background technique [0002] A lead material that coats the surface of a conductive member such as Cu monomer, Cu alloy, or Fe-Ni alloy with an electroplating layer of Sn monomer or Sn alloy has excellent electrical conductivity and mechanical strength possessed by Cu monomer or Cu alloy. In addition, this lead material is a high-performance conductor having both the corrosion resistance and good solderability of Sn alone or Sn alloy. Therefore, they are widely used in the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/72C25D7/12
CPCH01L2924/01005H01L2924/01078
Inventor 龟山工次郎
Owner SANYO ELECTRIC CO LTD