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Method for mounting video sensor

A technology of image sensor and installation method, which is applied in the fields of radiation control devices, film/sheet adhesives, semiconductor/solid device manufacturing, etc., can solve the problems of electronic device damage, electronic device resistance reduction, etc., to reduce adhesion, The effect of ensuring safety and improving effective utilization

Inactive Publication Date: 2009-02-18
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, with the miniaturization and high integration of electronic devices, the precision of circuits has been realized. On the other hand, the resistance of electronic devices against discharge has decreased, and the phenomenon of so-called destruction of electronic devices has been caused by the discharge when the adhesive tape is peeled off.

Method used

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  • Method for mounting video sensor
  • Method for mounting video sensor
  • Method for mounting video sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] A solution of an acrylic adhesive is applied on a substrate made of polyethylene naphthalate (substrate heat shrinkage rate: 0.4%: 150°C-30 minutes) with a thickness of 25 μm, and dried to obtain a thick Adhesive tape with 10 μm adhesive layer. After the adhesive tape was heated at 180°C for about 1 hour, the adhesive force was measured based on JIS Z0237, and it was 2.0N / 19mm, the heat shrinkage rate was 0.15%, and the light transmittance at 400nm to 700nm of the adhesive tape was More than 50% (average 88.0%).

Embodiment 2

[0100] On a substrate made of polyethylene naphthalate with a thickness of 25 μm, a quaternary ammonium salt (NR-121X manufactured by Colcott Co., Ltd.) was applied to the back side of the substrate of the adhesive tape. Subsequently, an acrylic adhesive solution was applied on the other side, and dried to obtain an adhesive tape in which an adhesive layer having a thickness of 10 μm was formed. After heating the adhesive tape at 180°C for about 1 hour, the adhesive force was measured according to JISZ0237, and it was 2.0N / 19mm, the heat shrinkage rate was 0.15%, and the light transmittance at 500nm of the adhesive tape was 86.0 %.

Embodiment 3

[0102] On a substrate made of polyethylene naphthalate with a thickness of 25 μm, the solution coated with an acrylic adhesive becomes a strip shape with a width of 10 mm and a width of 10 mm. An adhesive tape having an adhesive layer having a thickness of 5 μm was formed. The adhesive tape was made to have a slit of 20 mm wide so that the uncoated portion became the center of the adhesive tape, thereby obtaining an adhesive tape. production image 3Adhesive tape in which a=10mm and b=5mm. After heating this adhesive tape at 180° C. for about 1 hour, the adhesive force was measured in accordance with JIS Z0237, and it was 1.0 N / 19 mm, and the heat shrinkage rate was 0.15%.

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Abstract

The invention discloses an assembling method of image sensor and adhesive band, which adopts polynaphthalic gylcol ester as base to coat on one surface of adhesive band.

Description

technical field [0001] The present invention relates to a mounting process of an image sensor using a solid-state imaging device. Background technique [0002] Conventionally, in the manufacturing process of solid-state imaging devices, in order to prevent dust from adhering to and damaging the surface of the image sensor during mounting and manufacturing processes, a method of attaching a surface protection film having an adhesive layer to the light-receiving portion side of the image sensor is used. [0003] At this time, for the component mounting process, the method of putting the terminal part of the image sensor and the mounting substrate in the state of aligning them into the reflow soldering furnace to perform connection mounting at once is often used, because soldering is involved. Processes in high-temperature areas such as soldering require heat resistance for protective films and adhesive layers. However, most of the existing surface protection adhesive tapes do...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L27/146C09J7/02
Inventor 近藤广行高野均寺岛正
Owner NITTO DENKO CORP