Multi-chip module integrated with RF property

Abstract

The invention discloses a multi-chip module including plurality of inactive elements and showing better mechanical performance. The multi-chip module includes: A lamination base plate based on the organic material is which inserting high dielectric constant ceramic layer; At least one radio frequency / intermediate frequency active circuit chip which is connected to the base plate and disposed to carrying out two or more radio frequencies / intermediate frequency function; plurality of inactive elements which is connected to the base plate.

Description

[0001] Related technologies and their cross-references [0002] This application is based on and claims priority from Korean Application No. 2004-101410 filed on December 3, 2004, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to multi-chip modules, particularly multi-chip modules including bulk capacitors, which exhibit good mechanical properties, such as high flexural modulus, and can implement two or more different radio frequency Function. Background technique [0004] A multiple chip module (MCM) is a self-contained electronic package that may include multiple bare and / or packaged integrated circuit chips and multiple passive components, such as resistors, capacitors, and inductors, all of which are connected to the interconnect substrate. An MCM includes a multilayer interconnect substrate provided with a plurality of exposed active circuit chips and other components. Because there is a curre...

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Problems solved by technology

[0007] However, because the substrate of MCMs is made of a single material such as laminated organic or ceramic inorganic materials, it is difficult to simultaneously include large-capacity capacitors in the substrate and good mechanical properties such as high flexural modulus

That is, when the substrate 60 is made of a single laminated organic material such as FR4, a high flexural modulus can be obtained but a low dielectric constant

Therefore, when capacitive passive components, such as capacitors, are embedded in the substrate, the substrate material cannot be used as the dielectric material for the component

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