Testing method for guiding hole coppering thickness in wiring board
A test method and via hole technology are applied in the field of measuring copper plating thickness of via holes in flexible circuit boards on production lines, which can solve problems such as damage to products and waste.
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[0021] In a four-layer flexible printed circuit board product, the size of the via hole in the product is 0.25mm and 0.3mm. The specific implementation method is as follows: firstly, when drilling holes after cutting the copper foil, 20 0.25mm and 20 0.3mm two kinds of drilling holes are added in the scrap copper area, and the arrangement is shown in Figure 3. Copper plating is carried out by the hole plating process. After the copper plating is completed, it is cut off, and the hole section is analyzed, and the thickness of the hole copper is measured on a metallographic microscope (Jenco Instruments Inc. Model MET-233). The test results are listed in Table 2.
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