The invention discloses a MEMS (Micro Electro
Mechanical System)
gyroscope chip wafer-level testing
system and a testing and
screening method. The MEMS
gyroscope chip wafer-level testing
system comprises a control host and a
wafer carrying table for placing a wafer to be tested; a
program control motor is arranged below the wafer carrying table; the
program control motor is connected with the control host by a probe
station controller; a
probe card is fixed right above the wafer carrying table; the
probe card is connected with an
electrode of the wafer to be tested by a probe; the
probe card is respectively connected with the control host, a high-accuracy source table and a network analyzer; both the high-accuracy source table and the network analyzer are connected with the control host; and on the probe card, a MCU (Micro Controller Unit) is respectively and electrically connected with an
integrated circuit switching matrix, a C / V conversion
chip and a C / V conversion circuit module. According to the MEMS
gyroscope chip wafer-level testing
system and the testing and
screening method which are disclosed by the invention, by utilizing the control host, control on the probe card, the probe
station controller, the high-accuracy source table and the network analyzer is implemented, so that parameter testing and testing result determination of a gyroscope chip are implemented, and an unqualified chip is screened out and removed, and thus, a case that the unqualified chip flows into the next packaging process is effectively avoided, and packaging cost is greatly saved.