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Inner pin jointing tape coiling and tape coiling support packaging structure using the same

A technology of inner pins and pins, which is applied in the field of flexible wafer carriers to achieve the effects of improving fracture resistance, enhancing resistance to twisting, and being easy to manufacture and form.

Inactive Publication Date: 2009-04-22
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to overcome the defects existing in the existing inner pin bonding tape and the tape carrying package structure, and provide a new type of internal pin bonding tape and the tape carrying packaging structure using the tape , the technical problem to be solved is to make it possible to enhance the distortion resistance of the inner lead bonding tape, and each reinforcing lead has a cross or T-shaped alignment mark, which can assist the inner lead Alignment during joining and easy to form, very suitable for practical use

Method used

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  • Inner pin jointing tape coiling and tape coiling support packaging structure using the same
  • Inner pin jointing tape coiling and tape coiling support packaging structure using the same
  • Inner pin jointing tape coiling and tape coiling support packaging structure using the same

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Embodiment Construction

[0056] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the inner lead bonding reel according to the present invention and the reel carrying tape using the reel are described below. The specific implementation, structure, features and functions of the packaging structure are described in detail below.

[0057] Please refer to Figure 1(a), Figure 1(b), figure 2 and image 3 As shown, it is according to a specific embodiment of the present invention, and Fig. 1 is a schematic top view of an inner pin bonding tape, figure 2 is a partial top view diagram of the inner pin bonding tape on the reinforcing pin, image 3 is a schematic cross-sectional view of the inner pin bonding tape along one of the reinforcing pins.

[0058] The inner pin bonding tape 100 of a specific preferred embodiment of the present invention ...

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Abstract

The present invention relates to a connecting coiling tape with inner pins and the coiling bearing packaging structure using the coiling tape. For the connecting coiling tape with inner pins, the bendable dielectric layer of a component hole is provided with plural pins used for connecting the wafer and plural compensation pins. Each compensation pin is a contraposition marker in a crossing or T shape, and the contraposition markers are positioned on the outside of the component hole and glued on the bendable dielectric layer. Thereby, the contraposition markers have advantages of cooperating contraposition for inner lend connecting, easy manufacturing and ensuring non-distorting for the coiling tape.

Description

technical field [0001] The present invention relates to a flexible chip carrier, in particular to an inner lead bonding tape that assists alignment during in-lead bonding, is easy to manufacture, and ensures that the tape is not easily twisted and deformed. And a tape-on-reel packaging structure using the tape. Background technique [0002] In the field of semiconductor packaging, the types of chip carriers are mainly divided into hard and soft. Rigid chip carriers include rigid printed circuit boards, lead frames, ceramic substrates, etc., which cannot be used for tape and reel transmission; soft chip carriers have internal leads. Foot bonding tape, metal film, chip-on-chip film, etc., can be used for tape and reel transmission to achieve continuous packaging process. Generally speaking, the inner pin bonding tape has a device hole in each package unit, and a suspended inner pin is extended in the hole for inner pin bonding. [0003] Inner Lead Bonding (ILB) is an existin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/544
CPCH01L24/50H01L2224/50H01L2924/00012
Inventor 黄敏娥刘光华陈必昌
Owner CHIPMOS TECH INC
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