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Resin membrane forming method and apparatus thereof

A technology of resin film and resin, which is applied to the device for coating liquid on the surface, pre-treatment surface, coating, etc., can solve the problems of pores, unsightly appearance, etc., and achieve the prevention of poor contact, high-precision heating, stable quality, The effect of improved versatility

Inactive Publication Date: 2009-06-10
宫电高周波设备(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

It mainly solves the technical problem that in the existing method of forming a resin film on the surface of a metal material, induction heating is only used to heat and melt at about 240°C, and then cool to form a resin film.

Method used

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  • Resin membrane forming method and apparatus thereof
  • Resin membrane forming method and apparatus thereof
  • Resin membrane forming method and apparatus thereof

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Embodiment Construction

[0031] figure 1- Figure 4 It is an embodiment of the resin film forming method and apparatus of the present invention.

[0032] In FIG. 1, a resin film forming apparatus 1 has a transistor-type frequency conversion circuit 2, and four branches 2a-2d of the frequency conversion circuit 2 are respectively connected to four semiconductor switching elements FET3a-3d. And, among the branches 2a-2d of the frequency conversion circuit 2, the branch 2a and the branch 2b are connected in series, and the branch 2c and the branch 2d are connected in series. At the same time, since the connection point of branch 2a and branch 2c is connected to DC power supply + terminal 4a, and the connection point of branch circuit 2b and branch circuit 2d is connected to DC power supply - terminal 4b, a complete bridge circuit is formed. Furthermore, between the above-mentioned terminals 4a and 4b, an electrolytic capacitor 5 and a resistor 6 and a diode 7 connected in series are connected.

[0033]...

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PUM

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Abstract

The present invention relates toa resin film forming method and its equipment. It is characterized by that the resin is applied on the surface of metal workpiece, then said resin is heated and molten by using induction heating process, after having been cooled said resin is hardened so as to form resin film. Besides, said invention also provides the concrete steps of the above-mentioned induction heating process, so that one layer of thin resin film can meet the requirements of its durability and appearance quality.

Description

Technical field: [0001] The present invention relates to a method for forming a resin film on a predetermined surface of a metal material for the purpose of rust prevention or adhesion and related devices. Background technique: [0002] Conventionally, a method of forming a resin film on the surface of a metal material for the purpose of rust prevention or the like is disclosed in, for example, Patent Document 1 (JP-A-10-160090). The resin coating method is: forming a resin powder suspension on the surface of the steel plate, drying it to form a resin powder accumulation layer, heating and melting the accumulation layer by induction heating, and forming a molten film (resin film) on the steel plate surface . [0003] However, in the above-mentioned conventional resin coating method, since the resin powder accumulation layer formed on the surface of the steel sheet is only heated and melted at about 240° C. by induction heating, the resin film is formed by cooling. Due to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D7/14B05D7/02B05D3/00B05C9/14B05C9/12
Inventor 宫崎力
Owner 宫电高周波设备(上海)有限公司
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