2results about How to "Reduce loading and unloading" patented technology

The application belongs to the technical field of electrolytic polishing, and particularly relates to an electrolytic polishing device for semiconductor stainless steel pipes, which comprises an electrolytic cell, a collecting disc is placed in the electrolytic cell, two bearing seats are arranged in the collecting disc, and the bearing seats are fixedly connected with the collecting disc. In the electrolytic polishing operation of the semiconductor stainless steel pipe, the electrolyte continuously flows from the inner and outer sides of the steel pipe, hydrogen bubbles generated in the electrolytic reaction can be timely flushed and removed, the bubbles are prevented from adhering to the pipe wall to form a gas film, the electrolyte can be kept in continuous and uniform contact with the inner and outer surfaces of the steel pipe, the electrolyte on the surface of the pipe can be quickly renewed, a stable electrolytic environment can be maintained, local unpolished, uneven bright and dark and other problems can be effectively eliminated, the polishing uniformity and surface quality are improved, and the electrolyte can be reduced in the pipe and the gap between pipe fittings during batch processing, and the risk of subsequent corrosion and pollution is reduced.

This invention discloses a linkage device in the field of COF product packaging, including an inner lead receiving frame and an adhesive dispensing frame. A linkage frame is provided between the inner lead receiving frame and the adhesive dispensing frame. A through hole is provided on the inner lead receiving frame corresponding to the linkage frame, and a through hole is provided on the adhesive dispensing frame corresponding to the linkage frame. The linkage frame includes a base, and two sets of symmetrical support components are provided on the upper surface of the base. A pad is horizontally provided on each of the two support blocks, and two vertical support plates are fixed on the pads. The two support plates are distributed one in front of the other. An L-shaped mounting block is provided on the upper part of the two support plates, and a side guide rail is correspondingly provided on the mounting block. A central support guide rail is provided on the upper part of the central support rail. Two side guide rails are symmetrically distributed on the left and right sides of the central support guide rail, and the central support guide rail and the two side guide rails are parallel to each other. This invention can reduce manpower time, improve machine utilization efficiency, and increase output.