1results about How to "Reduce loading and unloading" patented technology

The application belongs to the technical field of electrolytic polishing, and particularly relates to an electrolytic polishing device for semiconductor stainless steel pipes, which comprises an electrolytic cell, a collecting disc is placed in the electrolytic cell, two bearing seats are arranged in the collecting disc, and the bearing seats are fixedly connected with the collecting disc. In the electrolytic polishing operation of the semiconductor stainless steel pipe, the electrolyte continuously flows from the inner and outer sides of the steel pipe, hydrogen bubbles generated in the electrolytic reaction can be timely flushed and removed, the bubbles are prevented from adhering to the pipe wall to form a gas film, the electrolyte can be kept in continuous and uniform contact with the inner and outer surfaces of the steel pipe, the electrolyte on the surface of the pipe can be quickly renewed, a stable electrolytic environment can be maintained, local unpolished, uneven bright and dark and other problems can be effectively eliminated, the polishing uniformity and surface quality are improved, and the electrolyte can be reduced in the pipe and the gap between pipe fittings during batch processing, and the risk of subsequent corrosion and pollution is reduced.