Package structure of crystal particle and manufacturing method thereof

Abstract

This invention discloses a package structure of grains and its manufactring method including the following steps: providing a flat with a first surface and a second surface, forming multiple first grains on the first surface of the flat and the first grain has a first surface and a second surface, forming multiple first humps on the first surface of the first grains and cutting the flat to form multiple grain groups, each of which has a flat unit, a first grain and multiple first humps, and the first grain is placed on the first surface of the flat unit so it is easy for single grains to be implanted on the humps.

Description

technical field [0001] The invention relates to a chip packaging method, in particular to a chip packaging structure and a manufacturing method thereof. Background technique [0002] Please refer to Figure 1A to Figure 1C , which represents a schematic diagram of a conventional chip manufacturing method. First, please refer to Figure 1A , a wafer 11 is provided, a plurality of chips 111 are defined in the wafer 11 (shown by dashed lines), and the wafer 11 has a first surface 112 . Please refer to Figure 1B , and then, forming a plurality of bumps 12 on the first surface 112 of the wafer 11 , wherein a preferred material of the bumps 12 is gold. Please refer to Figure 1C , and then, dicing the wafer 11 to form a plurality of chips 111 . [0003] The conventional chip packaging method is to form bumps 12 on the entire wafer 11 , and then cut the wafer 11 into chips 111 . It would be difficult and time consuming to plant bumps on a single chip. Therefore, the chip pa...

AI Technical Summary

Problems solved by technology

It will be difficult and time consuming to plant bumps on a single chip

Therefore, the chip packaging method of the prior art will not be able to meet the needs of planting bumps on a single chip

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