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Semiconductor sensor component with cavity cover and sensor chip and manufacturing method thereof

A sensor chip and sensor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of damaging the stability of the sensor chip, failure to rule out damage or reduction in bonding quality, loss of yield, etc.

Inactive Publication Date: 2009-08-19
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it cannot be ruled out that a previous failure determined by the manufacture of the semiconductor chip or the result of a reduction in the quality of the bonding, which impairs the stability of the sensor chip
Moreover, due to the mechanical stress on the sensor chip, the different thermal expansion coefficients of the materials used also cause a loss in yield

Method used

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  • Semiconductor sensor component with cavity cover and sensor chip and manufacturing method thereof
  • Semiconductor sensor component with cavity cover and sensor chip and manufacturing method thereof
  • Semiconductor sensor component with cavity cover and sensor chip and manufacturing method thereof

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Embodiment Construction

[0038] figure 1 A schematic cross-section through a semiconductor sensor device 20 according to one embodiment of the invention is shown. The semiconductor sensor component 20 has a chamber cover 1 . Such as figure 1 The cavity 2 of the cavity cover 1 shown is open towards the top. This opening 5 keeps the semiconductor sensor component 20 in direct contact with the surroundings 6 . Accordingly, the sensor region 4 of the sensor chip 3 arranged in the cavity 2 of the cavity cover 1 faces the opening 5 . All sides of the sensor chip 3 are embedded in the elastic rubber compound 7 in the cavity 2 of the cavity cover 1 .

[0039] Due to the structure of the semiconductor sensor device 20 described, the rigid cavity cover 1 is mechanically separated from the sensor chip 3 by embedding the sensor chip 3 in the elastic rubber compound 7 surrounding it everywhere. Thus, the different coefficients of expansion of the different materials of the cavity cover 1 , the leads, and th...

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Abstract

The invention relates to a semiconductor sensor device (20) with a chamber cover (1) and a sensor chip (3) and a method for its manufacture. The chamber cover (1) comprises an opening (5) directed towards the outside world (6). The sensor area (4) of the sensor chip (3) is arranged towards said opening (5). All sides of the sensor chip (3) in the cavity (2) of the cavity cover (1) are embedded in the elastic rubber material (7).

Description

technical field [0001] A semiconductor sensor device including a cavity cover and a sensor chip and a manufacturing method thereof. [0002] The present invention relates to a semiconductor sensor device including a cavity cover and a sensor chip and a manufacturing method thereof. Background technique [0003] From the patent application DE 10 2004 019 428.9 a semiconductor sensor component comprising a cavity cover is known. Such a semiconductor sensor device has the problem that since the sensor chip is fixed in the housing by bonding using a material with a low elastic modulus, the perturbation response of the mechanical load such as thermal strain or vibration load of the rigid housing affects the sensor. chips and partially corrupted the measurements. Such a sensor chip is protected against environmental influences by using a soft material, so that at least the upper side with the sensor region of the semiconductor sensor chip is protected from additional loads. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0203H01L23/24H01L31/0232
CPCH01L23/24H01L2224/92247H01L2924/01082H01L2224/85385H01L2224/48465H01L2924/01068H01L23/49861H01L2224/48247H01L24/83H01L2924/01033H01L2924/01006H01L31/0203H01L2224/83192H01L2224/8314H01L2224/48091H01L2224/73265H01L2224/32225H01L2224/85203H01L2224/85207H01L2924/14H01L2924/00014H01L2924/00H01L2924/00012
Inventor M·鲍尔A·克斯勒W·肖伯A·海默里J·马哈勒
Owner INFINEON TECH AG