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Digital camera module

A technology for digital cameras and modules, applied to TVs, color TVs, electrical components, etc., can solve problems such as the limitation of dual-chip packaging, the inability to implement wire bonding of the first chip 93, etc., and achieve the effect of good packaging airtightness

Inactive Publication Date: 2009-08-19
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the size of the second chip 95 is equal to or larger than that of the first chip 93, the wire bonding of the first chip 93 cannot be implemented.
As a result, there are more restrictions on dual-chip packaging

Method used

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Experimental program
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Embodiment Construction

[0017] see figure 1 As shown in the first preferred embodiment of the digital camera module of the present invention, the digital camera module 10 includes an image sensing chip package 101, a lens module 103 and a mirror holder 107, wherein the lens module 103 It is screwed into the mirror base 107 , the mirror base 107 is fixed on the image sensing chip package 101 , and the image sensing chip package 101 is in the optical path of the lens module 103 .

[0018] The image sensing chip package 101 includes a substrate 20 , a first chip 40 , a plurality of leads 50 a , 50 b , an adhesive 60 a , 60 b , a second chip 70 and a cover 80 .

[0019] The substrate 20 can be a ceramic substrate, a printed circuit board or a flame retardant epoxy resin circuit board (Flame Retardant Type 4, FR4). In the first preferred embodiment, the substrate 20 is a single-layer structure. The top surface of the substrate 20 is provided with a plurality of upper welding pads 201a, 201b, and the po...

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Abstract

A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Description

【Technical field】 [0001] The present invention relates to a digital camera module, in particular to a digital camera module with a double-chip image sensor package. 【Background technique】 [0002] At present, mobile phones are developing toward multifunctional trends, and mobile phones with camera functions are very popular once they are released. The digital camera module used in mobile phones not only needs to have good photographic performance, but also needs to meet the requirements of lightness, lightness and compactness to match the development trend of mobile phones. [0003] The size and performance of the image sensing chip package used to acquire images in the digital camera module is an important factor determining the size and photographic performance of the digital camera module. [0004] With the further development of the camera function of the mobile phone, such as the increase of demand for high pixel and auto focus, the digital camera module needs to add a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H01L25/00H01L23/488
CPCH01L2224/8592H04N5/2254H01L2224/48091H04N5/2257H04N5/2253H01L2924/16195H01L2224/32145H04N23/54H04N23/57H04N23/55H01L2924/00014
Inventor 吴英政苏英棠
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD