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High-precision quick level adjusting device

A leveling device and high-precision technology, applied in the directions of instruments, electrical components, instrument parts, etc., can solve the problems of insufficient stability of the leveling mechanism and low leveling accuracy, and achieve the effect of eliminating gaps and improving accuracy.

Active Publication Date: 2009-09-02
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a high-precision fast leveling device, which can effectively solve the shortcomings of low overall leveling accuracy and insufficient stability of the leveling mechanism in the prior art

Method used

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Embodiment Construction

[0020] The high-precision fast leveling device of the present invention will be described in further detail below in conjunction with a preferred embodiment.

[0021] Please combine Figure 1 to Figure 3 As shown, the high-precision fast leveling device of the present invention includes an adjustment platform 1, an installation base 6, and multiple sets of parallel reeds 2 installed between the adjustment platform 1 and the installation base 6, an online position measurement sensor assembly 3, an eccentric wheel / Cam assembly 4 , pretension tension spring 5 , executive wheel assembly 7 and drive motor 8 .

[0022] In this embodiment, both the adjustment platform 1 and the installation base 6 are circular, and three sets of parallel reeds 2 are used for connection. between 6. Correspondingly, the leveling device also includes three sets of on-line position measurement sensor assemblies 3, eccentric wheel / cam assembly 4 and executive wheel assembly 7, the on-line position meas...

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Abstract

The invention provides a high-precision fast leveling device, which includes an adjusting platform, a mounting base, multiple sets of parallel reeds arranged between the adjusting platform and the mounting base, an online position measuring sensor assembly, an eccentric wheel / cam assembly, a preset Tension spring, executive wheel assembly, wherein, the multiple groups of parallel reeds, online position measurement sensor assembly, eccentric wheel / cam assembly, pre-tension tension spring, and executive wheel assembly are all arranged at the same angle and corresponding to each other in the installation on the base. The invention adopts the parallel reed structure to meet the distribution requirements of large lateral stiffness and low vertical stiffness of the adjustment platform. At the same time, the stiffness of the pre-tightened spring body can be optimized to obtain the motor drive torque, which is directly installed on the adjustment platform for measurement. The sensor assembly can effectively eliminate the gap between the transmission mechanisms and improve the precision of the leveling device.

Description

technical field [0001] The invention relates to a fast leveling mechanism, in particular to a high-precision fast leveling device used in precision instruments and equipment in the field of semiconductor manufacturing. Background technique [0002] In the field of semiconductor manufacturing, the leveling of workpieces by precision instruments and equipment usually requires high precision, high efficiency and no damage to the surface of the workpiece. Some automatic leveling mechanisms in the prior art use motors plus screw nuts or piezoelectric ceramics to level the workpiece at three or four points under the bearing platform. This leveling mechanism does not damage the surface of the workpiece, but due to the wire There is a gap in the lever nut, and the piezoelectric ceramic has a gap, so it is difficult to achieve high precision. At the same time, because it needs to be adjusted point by point repeatedly, and because it is adjusted on the back of the workpiece, it needs ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00G12B5/00
Inventor 朱岳彬
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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