Minitype embeddable sound pickup array microphone and application thereof
A pickup and microphone technology, applied in the field of microphones, can solve problems such as difficulty in meeting specific functional requirements, complex structure of directional microphones, and single function, and achieve the effects of simple structure, low production cost, and convenient installation and use
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Embodiment 1
[0042] Example 1: see figure 1 , the microphone 1 of this embodiment is combined by two pickups 2 and 2' arranged side by side, the sound receiving ends 3 and 3' of the two pickups 2 and 2' are in the same direction, that is, facing the same direction and the end faces 4 and 4' are located at the same Plane, the two pickups 2 and 2' are omnidirectional circular pickups, the sides of which are glued together to form the pickup array microphone of the present invention, and the distance between the centers of the two pickups is less than 10mm. In this embodiment, the two pickups 2 and 2' each have two terminal pins 5, 5' and 6, 6', and the respective terminal pins of the two pickups 2 and 2' can be connected to different terminal posts or wires respectively to form an acoustic Two independent signals that do not interfere with each other on the circuit and the circuit to meet the needs of different application functions. For example, if one of the pickups is connected to a dela...
Embodiment 2
[0043] Example 2: see figure 2 , the microphone 1 is composed of two pickups 2 and 2' arranged side by side. The voice receiving ends 3 and 3' of the two pickups 2 and 2' face the same direction and the end faces 4 and 4' are on the same plane. The two pickups 2 and 2' 2' are all omnidirectional pickups, and they are covered with packaging materials, that is, the two pickups 2 and 2' are combined by the packaging 7 to form the pickup array microphone of the present invention. The ground pins 5' and 6' of the two pickups 2 and 2' of the present embodiment are connected together to form three ground pins. The outside of the package 7 of this embodiment can also be provided with a cover, and the end faces of the cover corresponding to the end faces 4 and 4' of the sound receiving ends 3 and 3' are provided with ventilation holes. Packaging 7 can be made of metal skin or plastic. Two omnidirectional pickups 2 and 2' of the present embodiment can be standard 6mm or 9.6mm pickups...
Embodiment 3
[0044] Embodiment 3: see image 3 and Figure 4 . The two pick-ups 2 and 2 ' that present embodiment arranges side by side are the semi-cylindrical pick-ups of half of common pick-up respectively, are to arrange section 8 to form two semi-cylindrical hollows completely isolated from each other in the cylinder of the size of a circular pick-up Cavities, and add materials such as vibrating membranes, transistors, and electrodes to each semi-cylindrical cavity to become an independent omnidirectional pickup. The spacer 8 in this embodiment is a T-shaped spacer. Figure 4 yes image 3 The rear view of , shows a way of setting the connection pins, that is, the ground pins 5' and 6' are connected together to form three ground pins.
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