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Method for producing heat radiator

A manufacturing method and radiator technology, which are applied in nanostructure manufacturing, electric solid state devices, semiconductor devices, etc., can solve the problems of affecting the heat dissipation effect of radiators, difficulty, and difficulty in growing carbon nanotube arrays, etc.

Inactive Publication Date: 2009-10-28
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the use of chemical vapor deposition to grow carbon nanotube arrays requires a catalyst layer to be deposited on the surface of the heat dissipation fins. The uniformity of the catalyst layer will affect the uniformity of the formed carbon nanotube arrays, and the current radiator fins The spacing is very small. Affected by the small spacing, it is very difficult to deposit a uniform catalyst layer on the surface of the heat dissipation fin, which makes it difficult to grow a uniform carbon nanotube array on the surface of the heat dissipation fin, which ultimately affects the heat dissipation of the radiator. Effect

Method used

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  • Method for producing heat radiator
  • Method for producing heat radiator
  • Method for producing heat radiator

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Embodiment Construction

[0030] The technical solution will be described in further detail below in conjunction with the accompanying drawings.

[0031] see figure 1 , the manufacturing method of the heat sink provided by the technical solution, comprising the following steps: providing a plurality of heat dissipation fins; treating the surfaces of the plurality of heat dissipation fins so that the surface is charged with the first electrical charge; A plurality of carbon nanotubes are processed so that one end thereof is charged with a second electric charge opposite to the first electric charge; the plurality of carbon nanotubes and the plurality of cooling fins are placed together in a liquid In the process, the carbon nanotubes are adsorbed on the surfaces of the plurality of cooling fins. The manufacturing method of the radiator provided by the technical solution is described in detail below in conjunction with the embodiments, please combine figure 1 and refer to Figure 2 to Figure 6 .

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Abstract

The invention provides a method for manufacturing a heat sink, which includes the following steps: providing a plurality of heat dissipation fins; treating the surfaces of the plurality of heat dissipation fins so that the surface is charged with a first electrical charge; A plurality of carbon nanotubes are processed so that only one end thereof is charged with a second electrical charge opposite to the first electrical property; a plurality of charged carbon nanotubes and a plurality of charged cooling fins are placed together in a In the liquid, a plurality of charged carbon nanotubes are adsorbed on surfaces of a plurality of charged heat dissipation fins. The manufacturing method of the heat sink provided by the invention adopts the characteristic of electrostatic adsorption to assemble the carbon nanotubes on the surface of the heat dissipation fins, so that the carbon nanotubes can be more evenly distributed on the surface of the heat dissipation fins, thereby obtaining a heat sink with high heat dissipation performance.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a radiator, in particular to a method for manufacturing a radiator with carbon nanotubes on its surface. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher. However, the volume of devices has become smaller and smaller, and their demand for heat dissipation has become higher and higher. more important question. To meet this requirement, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation have been widely used, and certain heat dissipation effects have been achieved. [0003] The two most important heat dissipation paths in a heat sink are heat conduction and heat convection. Heat conduction refers to the exchange of energy between molecules. Molecules with les...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36B82B3/00
Inventor 董才士
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD