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Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device

A technology for filling equipment and recessed areas, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., and can solve problems such as inability to form

Inactive Publication Date: 2009-11-11
NOVATEC SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Filling of a closed recessed area with a device that, when passed against the recess, causes compression of the air in the recessed area but never results in a complete, bubble-free fill

Method used

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  • Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device
  • Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device
  • Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] figure 1 with 2 Schematically shown in section view:

[0044] - a filling head 12,

[0045] - and, a means 11 for translating the substrate 1 so as to enable it to travel continuously (arrow A) under the above-mentioned filling head 12 ; here the substrate 1 consists of a printed circuit.

[0046] Although the relative translational movement of the filling head 12 relative to the substrate 1 can be obtained by moving the filling head 12 while keeping the substrate 1 fixed, it can also be obtained by keeping the filling head 12 fixed and moving the substrate 1, and the latter way is due to Adopted because it is easier to implement.

[0047] The filling head 12 realized in a manner consistent with the main setting of the invention comprises:

[0048] - a chamber 13 containing the filling 2; the chamber 13 is delimited downstream by a blade 7 with an angle of inclination α of 90° or less and upstream by a blade 7 inclined in the same direction with an angle of inclinat...

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PUM

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Abstract

The invention relates to a method and a device for filling a non-through recessed area (4) on the surface of a substrate (1) without using a mask or a screen. According to the invention, the method comprises sequentially, along the direction of displacement of the filling head (12) of the filling (2) relative to the substrate: a spreading means for the filling at the surface of the substrate, for A moving part (3) for moving the filling (2) at the position of the zone (4) to be filled, a part (7) for adjusting the thickness or scraping off excess filling (2), so that the above-mentioned filling The substance (2) remains in continuous contact with the area to be filled (4) from the start of filling to the scraping off of excess filling.

Description

technical field [0001] The invention relates to a device for filling a recessed area relative to a surface by evacuating air or gas and replacing it with a viscous liquid filling. Typically, these zones are long, narrow and deep. For example, the invention may be applied to realize printed circuits, such as those used in automobiles. Indeed, there are applications in which substrates with conductive tracks such as copper and with a thickness greater than 100 microns (typically of the order of 400 microns) are used. In these applications, the inter-track regions need to be filled with a dielectric, and this filling must be free of air bubbles to obtain optimum electrical characteristics and thickness in the recessed regions. Further, these inter-track areas do not have to be closed. After this filling operation, the printed circuit is subjected to a polymer addition and then to a brushing treatment. Background technique [0002] To carry out this filling, the person skill...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28H05K3/00B05C3/18H05K3/40
CPCB05C3/18H05K3/4053H05K2203/0139H05K2203/0143H05K2201/09881H05K3/28
Inventor 法朗西斯·博瑞尔瑞斯克莱门特·凯撒安托尼奥·西塞罗奥斯瓦尔多·诺维罗
Owner NOVATEC SA