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Bi-directional singulation system and method

A technology for dicing saws, saw blades, applied in the field of novel substrate saws

Inactive Publication Date: 2007-07-18
FA SYST AUTOMATION S PTE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But it is not possible to use such a system because it requires extreme precision, or the blank channel between the devices requires two cuts to remove the blank channel material

Method used

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  • Bi-directional singulation system and method
  • Bi-directional singulation system and method
  • Bi-directional singulation system and method

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Experimental program
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Embodiment Construction

[0043] FIG. 1 shows a schematic view of a wafer saw 1 in the prior art, which is engaged with an in-and-out type handling device 2 having a loading / unloading station 3 for loading and unloading wafers. Cutting is performed at a cutting station 5 by a single-axis saw 4 .

[0044] Fig. 2 has provided the block diagram of a preferred embodiment of bidirectional saw among the present invention, has shown dividing saw 6 among the figure, and this dividing saw 6 is joined together with handling device 2 in the prior art, and handling device 2 is suitable for slices, and has loading and unloading station 3. The saw 6 includes a cutting station 5 , a viewing station 7 and a two-axis saw 8 .

[0045] FIG. 3 shows a block diagram of another embodiment of the bidirectional split saw 6 of the present invention, the saw 6 is engaged with an output handling device 11 having an unloading station 10 . In the figure, the input loading and unloading device 9 is joined with the split saw 6 , a...

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PUM

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Abstract

In a singulation saw (6) for sawing either substrates or wafers there is provided a pair of counter-rotating saw blades (57, 58) mounted for independent movement in a vertical direction for alternately engaging with a first substrate (12) to be singulated. A transport system (33, 34) comprising a pair of substrate carriers (42, 43) reciprocates the first substrate under the pair of saw blades (57, 58) while alternate ones of the saw blades are engaged to cut the substrate. While the first substrate is being cut, the second or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system (44) for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate.

Description

technical field [0001] The present invention relates to an improved dividing saw suitable for use as a diamond wheel scribe or wafer saw. More particularly, the present invention relates to a novel substrate saw having a plurality of rotating saw blades adapted to cut or saw a substrate in two opposing directions of relative motion. Background technique [0002] Both diamond wheel dicers and split saws are known. Diamond wheel dicing machines coupled with specific saw blades have been used to singulate or separate semiconductor die from semiconductor wafers mounted on an adhesive on a layer of stretchable plastic film. Preferably a programmed diamond wheel dicing machine cuts the blank streets between the rows and columns of the semiconductor die to a depth that pierces the wafer and enters the adhesive layer so that one semiconductor die is fully sawn from the rest down. Most saws in the prior art are designed to saw a single blank channel or cut an entire wafer, then li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02B28D5/00B23D59/00
CPCY10T83/8766B28D5/0064Y10T83/7763B23D59/001Y10T83/464B28D5/029Y10T83/0524Y10T83/8822Y10T83/145Y10T83/4637Y10T83/037Y10T83/8769B28D5/025B28D5/0076
Inventor 大卫·沃尔特·史密斯威廉·艾伯特·布莱姆史帝文·约翰·迪平李欧
Owner FA SYST AUTOMATION S PTE