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Method of preparing heat interfacial material

A technology of thermal interface material and base material, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of thermal conductivity gap, high longitudinal thermal conductivity of carbon nanotubes, intertwined or self-entangled carbon nanotubes, etc. To achieve the effect of improving thermal conductivity

Active Publication Date: 2010-09-29
TSINGHUA UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thermal conductivity of thermal interface materials containing carbon nanotubes provided in the prior art still has a certain gap with the expected effect.
The reason is that the carbon nanotubes used to prepare the above-mentioned thermal interface materials have a large length during the growth process and are prone to intertwining or self-twisting, so the characteristics of high longitudinal thermal conductivity of carbon nanotubes cannot be fully utilized.

Method used

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  • Method of preparing heat interfacial material
  • Method of preparing heat interfacial material
  • Method of preparing heat interfacial material

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Embodiment Construction

[0025] The method for preparing the thermal interface material of this embodiment and the structure of the thermal interface material 20 prepared by this method will be described in detail below with reference to the accompanying drawings.

[0026] see figure 1 , figure 2 and image 3 , the preparation method of the thermal interface material in this embodiment mainly includes the following steps:

[0027] Step (1), providing a certain amount of carbon nanotubes 24 and liquid base material 22;

[0028] Among them, the base material 22 is a polymer material, including organic materials that are pre-liquid and solidified or solidified, such as silica gel series, polyethylene glycol, polyester, resin series, oxygen-deficient glue series or acrylic glue. series. In this embodiment, the two-component silicone elastomer (the specific model is Sylgard 160) of Dow Corning (Dow Corning) is preferred. Before mixing, Sylgard 160 is composed of two parts of liquid components A and B,...

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Abstract

The invention discloses a making method of heat boundary material, which comprises the following steps: (1) providing certain quantity of carbon nanometer pipe and liquid substrate material; (2) balling the carbon nanometer pipe over 4h; obtaining the balled carbon nanometer pipe with even length at 600-2000nm and at least one end opened; (3) blending the balled carbon nanometer pipe and liquid substrate material to form solid; obtaining the product.

Description

technical field [0001] The invention relates to a method for preparing a thermal interface material, in particular to a method for preparing a thermal interface material containing carbon nanotubes. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, while the volume of devices has become smaller and smaller, and its heat dissipation has become an increasingly important issue. The requirements are also getting higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as fan heat dissipation, water cooling auxiliary heat dissipation and heat pipe heat dissipation, etc., and a certain heat dissipation effect has been achieved. However, due to the uneven contact interface between the heat sink and the semiconductor integrated device, Generally, less than 2% of the area is ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/14
Inventor 宋鹏程刘长洪范守善
Owner TSINGHUA UNIV