Packaging method for white light illuminating diode

A technology for light-emitting diodes and packaging methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing white light-emitting diodes, the lifespan of white light-emitting diodes is not long enough, and limiting the application of white light-emitting diodes, etc. The effect of decay

Inactive Publication Date: 2007-11-07
NINGBO ANDY OPTOELECTRONIC CO LTD
View PDF0 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, at present, the above-mentioned various measures basically do not significantly reduce the light decay of white light emitting diodes, and the actual life of white light emitting diodes is still not long enough, which largely limits the application of white lig

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging method for white light illuminating diode
  • Packaging method for white light illuminating diode
  • Packaging method for white light illuminating diode

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] The white light-emitting diode packaged according to the packaging method of the present invention includes a bracket, a light-emitting diode die, a powder-dispensing glue and a phosphor. The light-emitting diode die is fixed on the bracket, and the phosphor and the powder-dispensing glue are mixed in proportion. The powder-mixing glue is formed by proportioning polydimethyl silicone and curing agent for LED encapsulation.

[0030] Please refer to FIG. 5, the packaging process of the white light emitting diode disclosed in this embodiment includes the following steps:

[0031] Step 1: Dispensing glue, that is, dispensing insulating glue into the reflector cup of the bracket.

[0032] Step 2: Bonding, that is, placing the prepared die on the support of the insulating glue.

[0033] Step 3: Baking after solidification, that is, putting the semi-finished product with solid crystal grains into a high-temperature oven for baking, so that the crystal grains are fixed and adhered ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

This invention relates to a packaging method for white light LED including the following steps: dropping insulation glue in a reflection ring of a frame, placing prepared grains on a frame dropped with insulation glue, baking the fixed semiconductor grains to adhere them fixedly, leading two wires from the baked grains at the positive and negative, configuring fluorescent powder and taking out polydimethyl silicon ketone, fixing agent for packaging LED and fluorescent powder to be mixed fully, dropping the prepared mixed fluorescent powder in the frame reflection ring welded with wires then to be baked and solidified, preparing glue, filling the glue and baking it.

Description

【Technical field】 [0001] The invention relates to a packaging method of a light emitting diode, more specifically, to a packaging method of a white light emitting diode. 【Background technique】 [0002] Light-emitting diode is a semiconductor light-emitting device, which is widely used as indicator lights, display screens, etc. White light-emitting diodes are known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. The theoretical lifespan of light-emitting diodes is about 100,000 hours. However, judging from the current white light-emitting diodes on the market, their lifespan is far from the theoretical 100,000 hours. Generally, at 1,000 hours, the light decay rate has reached more than 30%. , thus shortening the life of white light emitting diode products to a large extent. [0003] Packaging materials are one of the main factors that affect the light decay of white light emitting diodes. At present, conventional packaging mater...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/00H01L21/50H01L33/48
Inventor 占贤武
Owner NINGBO ANDY OPTOELECTRONIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap