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Packaging method for white light illuminating diode

A technology for light-emitting diodes and packaging methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing white light-emitting diodes, the lifespan of white light-emitting diodes is not long enough, and limiting the application of white light-emitting diodes, etc. The effect of decay

Inactive Publication Date: 2007-11-07
NINGBO ANDY OPTOELECTRONIC CO LTD
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AI Technical Summary

Problems solved by technology

[0004] However, at present, the above-mentioned various measures basically do not significantly reduce the light decay of white light emitting diodes, and the actual life of white light emitting diodes is still not long enough, which largely limits the application of white light emitting diodes in the field of lighting. Therefore, the market urgently needs A new packaging technology can greatly reduce the light decay of white light emitting diodes, so as to effectively promote the application of white light emitting diodes in the field of lighting

Method used

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  • Packaging method for white light illuminating diode
  • Packaging method for white light illuminating diode
  • Packaging method for white light illuminating diode

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Embodiment Construction

[0029] The white light emitting diode packaged according to the packaging method of the present invention includes a bracket, a light emitting diode crystal grain, a powder mixing glue and a fluorescent powder, the light emitting diode crystal grain is fixed on the bracket, the phosphor powder and the powder mixing glue are prepared in proportion, and the The powder compounding glue is prepared by proportioning polydimethylsilicone and curing agent for LED encapsulation.

[0030] Please refer to FIG. 5, the packaging process of the white light emitting diode disclosed in this embodiment includes the following steps:

[0031] Step 1: Dispensing glue, that is, dot insulating glue into the reflection cup of the bracket.

[0032] Step 2: Die bonding, that is, place the prepared die on the support of the insulating glue that has been placed.

[0033] Step 3: Baking after solidifying the crystal, that is, placing the semi-finished product with the solid crystal grain in a high-temp...

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Abstract

This invention relates to a packaging method for white light LED including the following steps: dropping insulation glue in a reflection ring of a frame, placing prepared grains on a frame dropped with insulation glue, baking the fixed semiconductor grains to adhere them fixedly, leading two wires from the baked grains at the positive and negative, configuring fluorescent powder and taking out polydimethyl silicon ketone, fixing agent for packaging LED and fluorescent powder to be mixed fully, dropping the prepared mixed fluorescent powder in the frame reflection ring welded with wires then to be baked and solidified, preparing glue, filling the glue and baking it.

Description

【Technical field】 [0001] The invention relates to a packaging method of a light emitting diode, more specifically, to a packaging method of a white light emitting diode. 【Background technique】 [0002] Light-emitting diode is a semiconductor light-emitting device, which is widely used as indicator lights, display screens, etc. White light-emitting diodes are known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. The theoretical lifespan of light-emitting diodes is about 100,000 hours. However, judging from the current white light-emitting diodes on the market, their lifespan is far from the theoretical 100,000 hours. Generally, at 1,000 hours, the light decay rate has reached more than 30%. , thus shortening the life of white light emitting diode products to a large extent. [0003] Packaging materials are one of the main factors that affect the light decay of white light emitting diodes. At present, conventional packaging mater...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/50H01L33/48
Inventor 占贤武
Owner NINGBO ANDY OPTOELECTRONIC CO LTD
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