Light-emitting diode packaging module

A technology for light-emitting diodes and molding, applied in optics, nonlinear optics, instruments, etc., can solve the problems of wasted cost, general products have no structure, light-emitting diode packaging module structure and inconvenient use, etc., and achieve the effect of reducing costs.

Inactive Publication Date: 2007-11-14
GIGNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

In this way, it is very wasteful to package the cost of each component
[0006] It can be seen that the above-mentioned existing light-emitting diode packaging module obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

Method used

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  • Light-emitting diode packaging module
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Embodiment Construction

[0065] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of the light-emitting diode packaging module proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Efficacy, detailed as follows.

[0066] The LED package module according to the preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

[0067] Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a perspective view showing a light emitting diode packaging module according to a preferred embodiment of the present invention, and FIG. 4 is a schematic diagram showing a light emitting diode packaging module according to a preferred embodiment of the present...

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Abstract

The invention relates to a LED package module, comprising a substrate, a first LED and an electric crystal, where the first LED is arranged on the substrate, and the electric crystal is connected with the first LED and arranged on the substrate to control on-off of the first LED, and the first LED and the electric crystal are located in the same package body. Thus, as compared with the existing techniques, it can reduce the cost of package manufacturing process.

Description

technical field [0001] The present invention relates to a diode package module, in particular to a package that can package light-emitting diodes and transistors in the same package, or can package any two of the light-emitting diodes, transistors and light-sensing elements in the same package. In the packaging body, the LED packaging module can save the cost of the packaging process. Background technique [0002] With the rapid development of science and technology, Light Emitted Diode (LED) has the advantages of light weight, power saving and long life, so it has been widely used in indicators and display devices of information, communication and consumer electronics products. , For example: indicator lights, portable flashlights, LCD backlight panels, ground lights, escape lights, medical equipment light sources, auxiliary lighting, main lighting, etc., so it is one of the important electronic components. At present, the application of white light-emitting diodes is also...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H05K1/18G02F1/13357G02F1/1335
CPCH01L2924/0002
Inventor 林峰立
Owner GIGNO TECH CO LTD
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