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Folding type heat radiation bottom plating

A cooling bottom plate, foldable technology, used in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of shrinking, increasing thickness, and inability to carry notebook computers out, and achieve the effect of increasing the heat dissipation area

Inactive Publication Date: 2008-01-02
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, the peripheral products currently used in notebook computers must have the characteristics of portability, otherwise they cannot be carried out with the notebook computer
The existing heat dissipation bottom plate has provided functions such as detachable, folding or stretching and shrinking, so as to reduce the space after unfolding and facilitate portability, but the volume after folding cannot further reduce the space it occupies. , especially in the thickness often increased to more than twice the original thickness
Therefore, the existing foldable heat dissipation bottom plate has the problem that its thickness increases significantly after being folded, and needs to be improved.

Method used

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  • Folding type heat radiation bottom plating
  • Folding type heat radiation bottom plating
  • Folding type heat radiation bottom plating

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Embodiment Construction

[0014] Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are respectively a schematic plan view of the present invention applied to a notebook computer, a three-dimensional exploded view and a three-dimensional assembled view of the present invention. The present invention provides a foldable heat dissipation bottom plate. After unfolded, the heat dissipation bottom plate 1 can be used for a notebook computer 2 to be placed on it, so as to help the notebook computer 2 to dissipate heat. The heat dissipation bottom plate 1 includes a connecting structure 10, a first heat dissipation plate 11 and a second heat dissipation plate 12; wherein:

[0015] Please also refer to FIG. 4 , the first and second heat dissipation plates 11 and 12 can be made of aluminum or copper to become good heat dissipation or heat conductors. The top surfaces of the first and second cooling plates 11, 12 are respectively a first bearing surface 110 and a second bearing surface 120, and the surface area ...

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Abstract

A kind of folding radiating soleplate includes a connection structure, a first radiating board and a second radiating board; bottom of the first and second radiating board possesses several first and second radiating blocks, and the first radiating block is arranged distantly, and the second radiating block is also arranged distantly to form a first flow channel between any two adjacent first radiating blocks, a second flow channel between any two adjacent second radiating blocks; thereinto, the first and second radiating board are connected by the connection structure, and when the first and second radiating board are folded for connection, the first radiating blocks are separately distributed in the second flow channel, and the second radiating blocks are separately distributed in the first flow channel.

Description

technical field [0001] The invention relates to a foldable heat dissipation bottom plate, in particular to a foldable heat dissipation bottom plate applied to a heat dissipation assembly added to a notebook computer. Background technique [0002] Generally speaking, since the notebook computer is mainly characterized by portability, its peripheral products must also be portable, so that it can be used conveniently when going out. However, when the notebook computer is used for a long time, it is easy to affect the heat dissipation due to the flatness of the bottom and the desktop, so there is a heat dissipation bottom plate used to place the bottom of the notebook computer to help it dissipate heat; the top surface of the heat dissipation bottom plate has the same The bottom of the notebook computer has a considerable heat dissipation area, and is usually made of a material with good heat dissipation characteristics such as aluminum or copper, so that the notebook computer c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20F16C11/04
Inventor 施博仁林志宪
Owner GIGA BYTE TECH CO LTD