Holding piece for retaining luminescence element, optical head and method for manufacturing the same

Abstract

The invention relates to a method of reducing problems of luminescence by connecting to luminescence substrate when adjusts optical axis of laser luminescence element on the luminescence substrate. Peristome (314a), which forms on luminescence part (312a) on base (312) of laser luminescence element (31), is covered by protection part (46) on fixing keep part (62), so that operator avoids connecting to luminescence substrate (313) and lead wire connection wiring (311a) when adjusts optical axis of optical header device (1).

Description

technical field [0001] The present invention relates to a light-emitting element fixing holder for fixing a light-emitting element to a device main body, an optical head device with a light-emitting element mounted on the device main body through the light-emitting element fixing holder, and a manufacturing method thereof. Background technique [0002] In optical head devices used for reproduction and recording of optical recording discs (optical recording media) such as CDs and DVDs, a device frame (on the device side) is equipped with a plurality of optical elements including a light emitting element and a light receiving element. [0003] Conventionally, in such an optical head device, a semiconductor laser in which a laser chip is housed in a cylindrical container has been used as a light emitting element, but the semiconductor laser needs to adjust the direction of the optical axis. Therefore, for example, it has been studied to use a light emitting element fixing holde...

AI Technical Summary

Problems solved by technology

[0008] However, when the concave tapered surface 623' of the fixed-side holder 62' or the concave curved surface with a large radius of curvature are used to support the convex curved surface 613' of the element-side holder 61' with an arc-shaped cross section, the contact area is narrow, so there is The problem that the heat generated when the semiconductor laser 31 is turned on cannot be dissipated to the device frame through the element-side holder 61' and the fixed-side holder 62' is not a good solution because this problem causes a decrease in the life of the semiconductor laser 31

[0009] In addition, when an adhesive is applied between the convex curved surface 613' and the concave tapered surface 623' or the concave curved surface with a large curvature radius to fix the element side holder 61' and the fixed side holder 62', the area of ​​the narrow gap size Narrow, so there is a problem of low bond strength

In particular, when an anaerobic adhesive is used as the adhesive, the area of ​​the narrow portion of the gap is small, and most of the injected adhesive is in contact with air, so there is a problem that the adhesive cannot be hardened sufficiently.

[0010] In addition, in the optical axis adjustment mechanism disclosed in the above cited document 1, when the optical axis adjustment is performed on the semiconductor laser disclosed in the above cited document 2, the semiconductor substrate is exposed, so when the semiconductor laser is mounted and fixed on the optical axis adjustment jig When lifting and adjusting the angle of the optical axis, the operator will accidentally touch the semiconductor substrate itself or the wire bonding wiring between the connection terminal and the semiconductor substrate, resulting in poor light emission and poor electrical connection.

Images