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Heat radiator

A heat dissipation device and a technology of heat dissipation fins, which are applied to the components of pumping devices for elastic fluids, cooling/ventilation/heating transformation, and instrument cooling, etc., can solve the problem of air flow velocity reduction, reduce the heat dissipation fin group 24 and The heat exchange efficiency of the airflow and the heat dissipation efficiency of the heat sink 20 cannot be effectively improved, etc.

Inactive Publication Date: 2008-01-16
FU ZHUN PRECISION IND SHENZHEN +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the upper side 246 of the heat dissipation fin set 24, the airflow direction is substantially parallel to the heat dissipation fins 242 there, while on the lower side 244 of the heat dissipation fin set 24, the air flow direction forms a clip with the heat dissipation fins 242 there. Angle, causing the airflow flowing to this place to collide with the heat dissipation fins 242 there, causing the airflow to lose a certain amount of kinetic energy, and the flow velocity of the airflow will drop significantly, thus reducing the heat exchange efficiency between the heat dissipation fin group 24 and the airflow. As a result, the heat dissipation efficiency of the heat dissipation device 20 cannot be effectively improved, so it needs to be improved

Method used

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0017] 1 to 3 show a first embodiment of a heat dissipation device 10 of the present invention. The heat dissipation device 10 includes a heat dissipation fin set 12 and a centrifugal fan 14 . The cooling fin set 12 is thermally connected with two heating electronic components (not shown) to absorb the heat generated by the heating electronic components, and the centrifugal fan 14 provides an airflow with a higher pressure blowing to the cooling fin set 12 to The heat absorbed by the cooling fin group 12 is dissipated into the surrounding air.

[0018] The two heat-generating electronic components are arranged laterally on one side of the heat-dissipating fin set 12 , and the heat-dissipating fin set 12 is thermally connected to the two heat-generating electronic components through two heat pipes 16 . The two heat pipes 16 are flat. E...

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Abstract

A heat dissipating device includes a centrifuging fan, and a heat-dissipating pins assembly formed by a plurality of heat-dissipating pins. The centrifuging fan has an air outlet; and the heat-dissipating pins assembly is provided at the air outlet and includes an arced section in which two adjacent heat-dissipating pins form a fan-shaped air passage, so that airflow flowing to the heat-dissipating pins assembly is maintained almost be parallel to the heat-dissipating pins, energy loss caused by impacting the airflow with the heat-dissipating pins is reduced, and heat-dissipating performance of the heat dissipating device is improved.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from heating electronic components. Background technique [0002] With the continuous improvement of the power of electronic components such as central processing unit (CPU), the problem of heat dissipation is more and more paid attention to by people, especially in notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the current industry mainly uses a combination of heat dissipation fins, heat pipes and heat dissipation fans for heat dissipation. The heat conduction path of this method is: the heat generated by the CPU is transmitted to the cooling fin set through the heat pipe, and then the airflow generated by the cooling fan will take away the heat transferred to the cooling fin set, so the matching of the cooling fan and the cooling fin set is right The cooling performance of the sy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467G12B15/04
CPCH01L23/467H01L23/3672F04D29/582H01L23/427H01L2924/0002H01L2924/00
Inventor 黄清白孟劲功
Owner FU ZHUN PRECISION IND SHENZHEN