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High power compact thermostatic device without liquid cooling

A constant temperature device, compact technology, applied in refrigerators, refrigeration and liquefaction, temperature control using electric methods, etc., can solve the problems of large volume of constant temperature devices, high production costs, hidden dangers of liquid leakage, etc., and achieve easy industrialized mass production , compact structure, fast cooling effect

Inactive Publication Date: 2008-02-06
WUHAN LINGYUN PHOTOELECTRONICS SYST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The above method has better temperature control effect and higher efficiency, but the thermostatic device has a large volume, a relatively complicated structure, high production cost, and there is a hidden danger of liquid leakage

Method used

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  • High power compact thermostatic device without liquid cooling
  • High power compact thermostatic device without liquid cooling

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Embodiment Construction

[0018] The specific embodiment of the high-power non-liquid-cooled compact constant temperature device referred to in the present invention is described as follows in conjunction with Fig. 2 and Fig. 3:

[0019] When the maximum laser output power of the diode laser 11 is 30W, about 40W of heat will be released at the same time. If the ambient temperature is 55°C, and the working temperature of the diode laser is lowered to 25°C within 10 minutes, a cooling capacity of about 20W, the thermal insulation box 6 dissipates about 10W, and requires a total cooling of about 70W. According to this cooling capacity, we select 3 (tiled) semiconductor thermoelectric devices 8 with a maximum cooling capacity of 120W, and a radiator 10 with a thermal resistance of less than 0.05K / W (note: when the ambient temperature reaches 55°C and the radiator heat When the resistance is less than 0.05K / W, the actual cooling capacity of each semiconductor thermoelectric device is 25W), the insulation bo...

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Abstract

The present invention relates to a high power non liquid cooling severe style constant temperature device, which consists of a thermal insulation unit, a semiconductor thermoelectric apparatus, a heat capacity block, a radiator, a temperature detector, a temperature control unit and a switching power. The thermal insulation unit consists of a thermal insulation box and thermal insulation filling materials, the thermal insulation filling materials is arranged in the thermal insulation box, the semiconductor thermoelectric apparatus, the heat capacity block and a temperature controlled optoelectronic device are arranged at the central part inside the thermal insulation box, and contacts with the thermal insulation filling materials; the temperature detector is directly pasted and covered on the outer surface of the optoelectronic device. The high power non liquid cooling severe style constant temperature device of the present invention has the advantages of novel concept, severe structure, large amount of refrigeration and heating, small size, convenient installation, no liquid refrigerator and compressor needed, no pollution, quick refrigeration speed, fine control performance, and easy industrialized batch production, etc; the present invention can be widely used for the temperature control of the apparatus needing constant temperature operation in the optoelectronic field, in particular to the site needing large amount of refrigeration and heating.

Description

technical field [0001] The invention relates to a constant temperature device, in particular to a high-power non-liquid-cooled compact constant temperature device. technical background [0002] In general, many optoelectronic devices need to work at a constant temperature or within a narrow temperature range, such as diode lasers. As the operating temperature changes, the wavelength of the laser output from the laser will drift (generally 0.25-0.3nm / °C), This kind of drift is unacceptable for some applications of this type of laser, such as being used as a pump source for solid-state lasers. Therefore, it is necessary to control the working temperature of the diode laser, especially when the ambient temperature changes within a wide range of -40 to 55°C, it is very necessary to configure a constant temperature device for the laser diode to ensure that the laser can be used no matter what temperature environment it is in. The operating temperature of the diode is relatively ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02G05D23/19
CPCY02B30/765Y02B30/70
Inventor 黄新王锋
Owner WUHAN LINGYUN PHOTOELECTRONICS SYST
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