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A tin overflow concave internal open kettle mouth

A technology of overflowing tin and concave shape, applied in the field of tin furnace components, can solve the problems of low work efficiency, unsuitable for large-scale batch processing, and easy formation of virtual welding of contacts, and achieves the effect of ensuring adequacy and firmness.

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • A tin overflow concave internal open kettle mouth

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Embodiment Construction

[0012] As shown in Figure 1, there is a concave-shaped inward-opening spout for tin overflow. The tin overflow opening 1 is a rectangular opening with a depth of 2-8 mm.

[0013] As shown in Figure 2, the spout according to the present invention is mainly used for welding where the lead wires are distributed in the "concave" shaped welding area and close to the internal welding area. The thick solid line in the figure represents the tin overflow port. There are no electronic components 3 on the PCBA board 2 in the concave part of the spout, or they are far away from the spout, while electronic components 3 are closely distributed on the outer periphery of the spout.

[0014] When in use, place the PCBA board 2 at a predetermined position above the spout, and keep a certain distance between the plane of the board and the tin outlet of the spout, generally controlled at 2-6 mm. The shape of the spout can be determined according to the distribution of the welding parts of the PC...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice. The kettle orifice has a concave shape, a tin overflow orifice is arranged at the concave tin outlet of the kettle orifice, the tin overflow orifice is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can improve the soldering efficiency, is suitable for mass automatic production, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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