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Appearance detecting device

A technology for visual inspection devices and inspection areas, applied to measurement devices, material analysis through optical means, instruments, etc., can solve the problem of inability to effectively inspect the flaws on the periphery of wafers

Inactive Publication Date: 2011-07-06
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, using the technique disclosed in JP 2004-518293 A can not effectively inspect the peripheral edge flaws of the wafer.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0016] Such as figure 1 As shown, the appearance inspection device 1 has a base portion 2 fixed to a frame (not shown) or the like, and an inspection portion 3 is attached to the base portion 2 . The inspection unit 3 includes: a wafer holding unit 4 on which a wafer W to be inspected is placed; The wafer holding unit 4 and the peripheral edge imaging unit 5 are controlled by an apparatus control unit 6 . In addition, in addition to the peripheral imaging unit 5 , a surface inspection unit such as a microscope capable of observing the wafer W in its entirety may be provided.

[0017] The wafer holding part 4 is fixed on the base part 2 and has a figure 1 The X-stage 11 shown by X in the horizontal direction is mounted on the X-stage 11 and can move along the horizontal direction perpendicular to the X-axis, that is, the Y-axis. In addition, a Z stage 13 movable in the Z direction in the height direction perpendicular to the XY direction is attached to the Y stage 12 . Thus...

no. 2 Embodiment approach

[0041] The main feature of this embodiment is that the observation range and position can be automatically set using pre-registered data. In addition, the configuration of the appearance inspection device is the same as that of the first embodiment.

[0042] Examples of pre-registered data include data indicating the position and range of the portion where the robot arm that transfers the wafer W onto the wafer holding unit 4 holds the wafer W. E.g Figure 5 As shown, the robot arm 93 of the device 92 for transferring the wafer W from the wafer cassette 91 to the visual inspection device 1 clamps the wafer W by using two fixed holding parts 93A, 93B and one movable holding part 93C. Next, on the wafer W, three held portions W1 receiving forces from the holding portions 93A to 93C are formed. The held portion W1 is a portion in contact with the gripped portion and receives an external force, so defects such as scratches and adhesion of foreign matter are more likely to occur ...

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PUM

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Abstract

The invention relates to an appearance examining device which is able to effectively examine the wafer circumference portion. The appearance examining device displays the appointed menu in the examination area on the monitor so as to examine the any area of the wafer circumference portion. The examination area appointed menu has a display portion with the display observing range and an input portion provided with the observing area. In the input portion, it may select any one of the observing style such as stepping, continuing, and appointing position and registers the prescription according to the setting condition and applies the examination.

Description

technical field [0001] The present invention relates to an apparatus for inspecting the appearance of the peripheral portion of a substrate such as a wafer. [0002] This application claims priority from prior Japanese Patent Application No. 2006-268479 filed on September 29, 2006, the contents of which are incorporated herein by reference. Background technique [0003] In a semiconductor manufacturing plant or the like, scratches and cracks may occur as defects on the peripheral portion of a semiconductor wafer. If such defects are left unattended, they will cause wafer breakage in the middle of the manufacturing process. In addition, if the wafer is cracked, losses such as the need to stop the manufacturing equipment for a long time will occur. Therefore, in recent years, in manufacturing plants, measures such as inspecting the peripheral portion of the wafer, checking for defects such as flaws generated in the middle of the process, and collecting the wafer as necessary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/892G01N21/95H01L21/66
CPCG01N21/9503
Inventor 小室考广
Owner OLYMPUS CORP