Low-temperature reinforcing system and method for computer

A computer and low-temperature technology, applied in the computer field, can solve problems such as failure to save system parameters and information, EC failure to work, failure to save data, etc., and achieve the effects of easy procurement, low cost, and flexible control

Active Publication Date: 2008-04-02
LENOVO (BEIJING) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, there are some systems that use hardware to harden the system at low temperature. The problem with these systems is that it cannot save the data of EC when S3 sleeps (that is, sleeps to memory)
When entering S3 hibernation, the notebook system will drop to the same temperature as the environment. At low temperature, EC cannot work normally, and cannot save various parameters and information of the system before S3 hibernation. When S3 wakes up, due to the loss of these data, it will cause System crashes and does not function properly

Method used

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  • Low-temperature reinforcing system and method for computer

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Embodiment Construction

[0020] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings. It should be noted that the described embodiments are for the purpose of illustration only, and do not limit the scope of the present invention. The various numerical values ​​described are not intended to limit the present invention, and these numerical values ​​can be appropriately modified according to the needs of those of ordinary skill in the art.

[0021] The present invention adds an industrial-grade single-chip microcomputer (MCU) and a heating film to the existing notebook computer. The heating film mainly covers the surface of the embedded controller (EC) chip, and the heating is controlled by the single-chip computer, so that the commercial-grade notebook can easily achieve industrial and aerospace requirements.

[0022] FIG. 1 shows a block diagram of the internal structure of a computer system according to the present inventio...

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Abstract

The invention provides a computer cryogenic reinforced system, comprising a singlechip used for controlling the operation of a flush bonding controller in low temperature environment; a plurality of data interfaces and a plurality of general input/output base pins; a plurality of sensors which are used for measuring the temperature of a plurality of different positions and are connected with the singlechip through one data interface of the singlechip; the flush bonding controller is connected with the singlechip through one data interface, transmits the signal indicating a normal working state to the singlechip through the data interface, and receives a boot-strap signal and a reset signal through the general input/output base pins of the singlechip; a flush bonding controller electric control module is used for supplying electricity for the flush bonding controller and is controlled by the singlechip through the general input/output base pins; a flush bonding controller heating control module is used for heating the flush bonding controller and is controlled by the singlechip through the general input/output base pins. The singlechip chip is an industry chip while other chips in the computer system are commerce chips.

Description

technical field [0001] The present invention relates to the field of computers, more specifically, to a computer low-temperature hardening system and method, which can make the computer work at a lower temperature by adding an industrial-grade single-chip microcomputer and related heating modules. Background technique [0002] At present, most of the chips on notebook computers are commercial-grade chips, and basically they can only work normally when the temperature is above zero. The embedded controller including the core (abbreviated as EC) is also a commercial-grade chip, which greatly limits the use environment of notebooks: it cannot work below zero. However, using industrial-grade chips, although low-temperature hardened notebook computers can be obtained, due to the high price and scarce supply of industrial-grade chips, the cost of notebook computers has increased significantly. [0003] Chinese invention CN2567679 discloses a portable computer suitable for use at ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/30G06F1/20
Inventor 章丹峰
Owner LENOVO (BEIJING) CO LTD
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